PCB plating and dry zedoary difference
PCB plating and dry zedoary difference
Heavy gold plate with gold plated board is used often by PCB process, what is the difference between the them
Heavy gold plate with gold plated board is used often by PCB process, many readers are unable to distinguish between different of the two, there are even some customers think that there is no difference.
Then the two "gold plate" to circuit board can cause what influence? Let me explain for everybody, help you concept thoroughly clear.
What is gold plated What we mean by the entire board gold-plated, gold-plated generally refers to the "electricity" "gold plating nickel plate electrolytic gold" "gold" "electroless nickel gold plate", distinguished by soft and hard gold (hard gold is commonly used in gold finger).Principle is to nickel and gold (commonly known as gold salt dissolves) in the chemical liquid medicine, the circuit board in electroplating cylinder and the current is switched on and in circuit board copper foil generated on the surface of nickel and gold plating, electroless nickel gold by coating high hardness, wear resistance, the advantage of not easy oxidation has been widely used in electronic products.
What are a heavy gold? Turmeric is generated by the method of chemical oxidation reduction reactions a layer of coating, the general thickness is thicker, is a kind of chemical nickel gold layer deposition method
1.The difference between the PCB heavy gold plate and gilded plate1, general heavy gold for the thickness of the gold much thicker than the gold-plated, zedoary will are golden more yellow than a gold-plated, see customers more satisfied with the heavy gold surface. Formed by the two different crystal structure.
2, due to the heavy gold and gold-plated crystal structure, which is formed by the heavy gold more easily than a gold-plated welding, won't cause bad welding, cause customer complaints. Also because of heavy gold than gold plated soft, so generally choose aureate gold finger board, hard gold wear-resisting.
3, sink only welding plate nickel, gold, gold plate is skin effect in the signal transmission in copper layer will not affect the signal.
4, heavy metal crystal structure more compact than a gold-plated, not easy to oxidation.
5, as the wiring is more and more close, has reached a 3-4 mil line width and spacing, gold-plated is easy to produce gold silk short circuit. Heavy gold plate only nickel gold bonding pad, so will not produce into gold short circuit.
6, heavy metal plate only nickel gold bonding pad, so on a line of resistance welding and copper layer combined with stronger. Engineering did not compensate on impact on spacing.
7, generally used for relative to demand higher board, flatness is better, generally with a heavy gold, zedoary generally won't appear black pad phenomenon after assembly. Heavy gold plate of smoothness and inactive life just as good as gold plated board.
This is heavy gold board and the difference of gold plated board, now on the market price is expensive, in order to save the cost of gold plated board, many producers have been reluctant to production do welding plate are nickel and gold plate of gold, and the price is cheap.
Heavy gold plate with gold plate:1, the heavy gold plate with gold plate is the same kind of technology products, electric gold plate with gold plate is the same kind of technology products, in fact just different term for different populations in PCB industry, heavy gold plate with electric gold board found in the mainland, and the gold plate with the flash gold plate in Taiwan.
1, heavy gold plate/gold plate is generally a formal name for the chemical nickel gold plate or nickel leaching gold plate, and the growth of nickel/gold layer is with the method of chemical deposition on the plating; The lightning gold plate/gold plate is generally formal term gold plating nickel plate or flash gold plated board, the growth of nickel/gold layer is with the method of direct current plating on the plating.
2.Why don't generally "tin"?As the IC integration is higher and higher, IC feet more close. And hard to turn into a tin injection for vertical thin solder leveling, this brought difficulty to SMT SMT; Another tin plate for life (shelf life) is short. The gold-plated look good solve these problems:
3, for SMT process, especially for 0603 and 0402 subminiature table, because the welding plate flatness is directly related to the quality of the solder paste printing process, play a decisive influence on the back of the reflow welding quality, so, the entire board gold-plated in high density and subminiature process often seen in the table. 2 in the development phase, the influence of factors such as components procurement is often not the board to the welding immediately, but often have to wait a few weeks or even months before use, inactive life of gold plated board (shelf life) is longer than lead tin alloy many times so everyone is willing to adopt, and gold-plated PCB in degrees of the cost of the sample stage compared with pewter plates.
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