FPC electroplating process knowledge, learn more from it!

                       FPC electroplating process knowledge, learn more from it!

1,flexible PCB FPC FPC electroplating before processing after cladding coating exposed surface of the copper conductor may have adhesive or ink pollution, also there will be generated due to the high temperature process of oxidation, discoloration, to obtain good tight adhesion coating must remove pollution and oxide layer on the surface of the conductor, the conductor surface clean.

But some of these pollution are combined with copper conductor is very strong, with weak detergent cannot completely remove, so that most often USES a certain strength of alkaline abrasives and brush and used for processing, most layer adhesives is a kind of epoxy resin and alkali resistant performance is poor, so as to cause a decline in bonding strength, though not visible, but in FPC electroplating process, plating solution is available Can be from the edge of the layer infiltration, serious when overburden stripping.

When the final welding solder drill to cover the following phenomenon. Can say pre-treatment cleaning process for mulberry PCB F (C basic characteristics have a significant impact, must be to give full attention to the processing conditions.

2, the thickness of the FPC electroplating electroplating, plating metal deposition rate is directly related to the intensity of electric field and electric field intensity and with the shape of the line graph, the position relationship between electrodes, the general wire line on the thinner, terminal parts of the terminal is pointed, the greater the closer the distance of the electric field intensity and electrode, the parts of the coating is thick.

In and mulberry PCB related use, in the same line with difference many conductors in great conditions exist it's easier to produce coating thickness is not uniform, in order to prevent the happening of this kind of situation, can be in line attached diversion around the cathode graphics, absorb the graphics on uneven current distribution in electroplating, coating thickness on the maximum guarantee all parts evenly.

So must work in the structure of the electrode. Proposed a compromise here, for the part of the high standard strict coating thickness uniformity, for the other parts of the standard relatively relaxed, for example, the fusion welding lead, tin plating, metal wire by (welding) of gold plated layer standard is higher,and for general corrosion of lead, tin plating, the plating thickness required relatively relaxed.

3, FPC electroplating stains, dirt just good plating coating state, especially the appearance is no problem, but after some phenomenon such as surface stains, dirt, color changing, especially when factory inspection did not find what is the difference, but when a user receiving inspection, found that the appearance problem. This is due to inadequate drift, coating on the surface of the residual plating solution, slowly, over a period of time for chemical reaction.

Especially the flexible printed circuit board, because soft and not very smooth, the sunken place easy to accumulate all kinds of solutions, and then will react in the region and color, in order to prevent the occurrence of this kind of situation should not only fully, but also to fully dry processing. Can drift through high temperature thermal aging test to confirm whether fully.