What kind of PCB board can we make
What kind of PCB board can we make
Product categories:
FR4: Double-sided and multilayer board (up to 24 layers)
Thick copper plating board: the biggest thickness of the outer copper is 15oz,inner copper thickness is 12oz
Thick gold plating board: the biggest thickness of the gold is 150u’
Metal base printed board:Aluminum base printed board, Copper base printed board,Iron base printed board, FR4 or Metal mixing laminate,Rigid-Flexible PCB,up to 10 layers Rigid-Flexible PCB
High frequency board: Rogers series, isola series
Ceramic substrate PCB: Alumina ceramic PCB, Aluminum nitride ceramics PCB, Single-sides and double-sided ceramic PCB
Blind buried vias PCB: First order blind buried,2 order blind buried,3 order blind buried,10 layers of any interconnection blind buried
Other special circuit boards: aluminum foil FPC, large size circuit board.
Special technical :
The technical of nickel palladium gold, thick copper and thick gold
Resin plug hole technical
Silver pulp and copper pulp irrigation technical.
Technical ability
|
Project |
Parameter |
|
Layers |
1-24 layers |
|
Material |
FR4,TG150, TG170, TG180, High frequency material, Ceramic material, Metal base material,Rigid-Flexible material |
|
Thickness |
0.1-6.5mm |
|
Maximum single size |
600mm*1200mm |
|
The thickness of copper |
the biggest thickness of the outer copper is 15oz,inner copper thickness is 12oz |
|
Minimum hole diameter |
0.1mm |
|
Handling hole |
Blind hole,buried hole,half hole,resin plug hole,sunk head hole, silver paste irrigation hole,copper pulp irrigation hole |
|
the maximum thickness of copper |
40um |
|
The depth ratio of hole diameter |
10:1 |
|
Minimum line width and line spacing |
Sample 3/3Mil,mass production 3.5/3.5Mil |
|
Line width tolerance |
±20% |
|
Minimum BGA ball |
8MIL |
|
The minimum spacing of BGA to line |
6MIL |
|
Minimum spacing between BGA and PAD |
8MIL |
|
Solder Mask dam |
4MIL |
|
The distance of inner hole to line |
4 layers board 6mil,6/8 layers board 8MIL |
|
warped degrees |
≤0.75% |
|
Impedance control |
+/-%10 |
|
The test process |
Rack test and flying needle test |
|
Surface technical |
Tin spray with lead, Tin spray without lead,Sink tin, Sink silver, Sink gold,Sink nickel palladium gold,Electric flexible gold,Electric rigid gold, gold finger, antioxidant |
|
Gold thickness |
140u’ |
|
Thickness of spray tin |
1-40um |
|
Resistance welding color |
Green,White,Black, Yellow,Red |
|
The order of blind buried holes |
First order blind buried,2 order blind buried,3 order blind buried |
|
One-time electrical test direct pass rate |
>99.5%(single-side board),>98.5%( double-side board),>97%(4 layers board),>95%( 6 layers board),>93.5%( 8 layers board) |
|
Scrap rate |
0.5%(single-side board),0.8%(double-side board),2%(4 layers board),3%(6 layers board),4-5%(8 layers board and above) |
|
Others |
Multilayer metal base board, aluminum foil FPC |
If there is more questions, please feel free to contact us.
Tel:+86-0755-23050569
mobile phone:+86-15919476409
Skype: zenglixia666
Email: bluesky@xdpcba.com
Website: www.xdpcba.com
Xing Da Electric Technology Co.,Ltd
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