Laser Cutting/Machining Alumina Ceramic Substrates

2022-01-14

Basic Info

Application: Food, Construction, Aerospace, Aviation, Chemical, Petroleum
Material: Silicon Nitride Ceramic
Corrosion Rate: 0.001-0.01
Trademark: XingDa
Specification: 50x50x30cm
HS Code: 8547100000
Customized: Customized
Certification: ISO
Feature: Wear Resistant
Lead Time: 15-30days
Transport Package: Carton or Wooden Case Packaging
Origin: China

Product Description

Ceramic Substrates are used in many electronic applications where a thin insulating layer of thermally
stable material is required to conduct heat away from electronic components whilst electrically insulating
them, and material is 92%, 96%, 99%alumina, zirconia and ZTA.

Properties with excellent insulation, high mechanical strength, high thermal conductivity, low expansion
coefficient, small dielectric constant, high-temperature resistance, excellent erosion and wear resistance,
good quality in chemical shock heat and cold.

Supply alumina ceramic substrate:
Thickness: 0.3 - 2mm
Size: 10 - 300mm, According to drawing.

Laser Cutting ceramic substrate:
Cutting the highest accuracy: +/- 0.02mm
Cutting Maximum size: 152.4 x 152.4 mm
Cutting Minimum aperture diameter: 0.1mm
Cutting Maximum thickness: 1.5mm

Product Name	Ceramic Substrates
Material	Alumina, Zirconia and Silicon Nitride Ceramic
Color	Black and White
Size	10-300mm
Thickness	0.3mm, 0.38mm, 0.5mm, 0.635mm,1mm, And According to drawings
Surface Roughness	Ra0.2
Tolerance	+/-0.01mm
Lead time	15 - 30days
Max. Working	1500 -1700 °C
Samples	Avaliable
Shipping	Air Express (DHL/UPS/TNT/ FedEx) or Ocean Shipping

Products Show:

Properties	Units	96% Al2O3	99% Al2O3	Zirconia	Silicon Nitride	Machinable Ceramic
Material Characteristics
Gas Permeability		0	0	0	0	0
Water Absorption	%	0%	0%	0%	0%	0.038%
Colour		White	Ivory	White	Grey	White
Density	g/cm³	3.7	3.85	6	3.2	2.7
Physical Characteristics
Hardness	Kg/mm²	1100	1400	1100	1600	1175
Modulus of Elasticity	Gpa	300	350	200	300	65
Flexural Strength	Mpa	300	340	1150	600	108
Compressive Strength	Mpa	2100	2200	2500	2500	488
Fracture Toughness	Mpam^1/2	3.5	4	12	6
Thermodynamic Property
Max Use Temperature	°C	1500	1650	1500	1800	800
Thermal Conductiviey	W/(m.k)	25	27.5	2.5	20	1.68
Thermal Expansion Coefficient	10^-6/°C	7.5	8	10	3.2	8.6
Thermal Shock Resistance	△T°C	200	200	250	600	200
Specific Heat	J/kg.K	860	860	500	500
Electrical Specification
Dielectric Strength	KV/mm	12	10	5		40
Dielectric Constant	εr	9.5	9.1	12	6	7
Volume Resistivity	Ω	≥10¹⁴	≥10¹⁴	≥10¹⁰	≥10¹⁴	≥10¹⁶
Dielectric Loss Angle		0.0002	0.0002	0.001