items that PCB design engineers must know

1, Does the PCB need to be assembled?

2, Does the PCB need to increase the process side?

3, Does the PCB have a Mark point?

4, Is the PCB pad design conformable to manufacturability?

5, Is the PCB jack design conformable to manufacturability?

6, Is the choice of device compatible with manufacturability?

7, Does the placement and patch layout meet the requirements?

8, Does the density between components meet the requirements?

9, component layout direction?

10, Does the height of the components meet the structural requirements?

11, SOP device pin tail should have a scratch pad

12, insert the solder pad at the end of the pin when there are many pins in the in-line device

13, the solid arrow on the PCB marked the direction of the tin furnace

14, the silk screen frame of the barcode pasting area should be designed on the PCB

15, is the information on the PCB complete?

16, Is the silk screen of the triode complete?

17, PCB has polarity or installation direction components, its polarity and direction should be reflected on the silk screen

18, silk screen characters, polarity and direction of silk screen marks can not be covered by components, etc.

19, whether the components with large differences in body height are in close alignment (shadow effect)

20, V-CUT line on both sides to keep the device forbidden area less than 1mm
21, PCB layout is easy to repair

22, BGA chip distance from peripheral devices

23, BGA package chip should be placed on the front

24, component wiring and pad wiring are symmetrical

25, the connection can only be led out at the end of the pad, prohibiting the middle trace

26, heating elements should be evenly distributed to facilitate heat dissipation

27, IC decoupling capacitor should be as close as possible to the power supply pin of the IC

28, when laying out components, consider concentrating the devices of the same power source for subsequent separation.

29, the series matching resistor layout is close to the driving end of the signal, the distance is generally not more than 500mil

30, PCB traces should avoid right angles and acute angles

31, isolated copper areas should be avoided, it is recommended to ground or delete

32, the wiring follows the 3W rule (the line spacing is greater than 3 times the line width)

33, 20H rule

34, Do you need a detection point?

35, Is there a signal line under the crystal, transformer, diaphragm, and power module?

36, the device serial number should be placed according to certain rules, should avoid random placement

37, DDR and other device connections are treated as equal length