Introduction to FPC Design

                                                     Introduction to FPC Design

        Flexible printed circuit board (FPC Flexible Printed circuit) is a kind of circuit form which is made on the flexible end of the surface. There may or may not be a cover (usually used to protect FPC circuits. Because FPC can bend, fold, or repeat motion in many ways, it is light compared to ordinary hard boards). Thin, flexible and other advantages, so it is more and more widely used.

        FPC Film-based materials are commonly used as polyimide,  which is also useful for polyester. The material thickness is 12.5 / 25 / 50 / 75 / 125um. Usually 12.5 and 25um. if FPC needs to be welded at high temperature, its material is usually made of Pi, while the substrate of PCB is usually made of FR4.

        The cover layer of the FPC is a laminate of a dielectric film and a glue , or a coating of a flexible medium , and has the protective effect of avoiding contamination , moisture , scratch , and the main material is consistent with the material of the base layer , i.e . , polyimide and polyesters , commonly used materials having a thickness of 12.5 um .

        When designing FPC, you need to bond the layers together, and you need to use the FPC glue Adhesive.Acrylicics are commonly used in flexible plates. Modified epoxy resin modified Epoxylic, Phenolic Butyralsof Phenolic, enhanced adhesive, pressure sensitive adhesive, etc. The monolayer FPC does not have to be glued with glue.

        In many applications, such as welding with devices, flexible plates need to be reinforced to obtain external support. Pi or Polyester films and glass fibers are mainly used. Polymer materials, steel sheets, aluminum sheets, etc. Pi or Polyester thin films are commonly used to reinforce flexible plates. The thickness is generally 125 um.Fiberglass FR4) has a higher hardness than that of Pi or Polyester and is relatively difficult to process where it is required to be stiffer.