High temperature PCB ceramic PCB

ANSOFT high temperature PCB board-level solution

Ceramic substrate is divided into crystal glass and glass and filler type,

mainly in aluminum oxide as filler. On-board conductive pattern material is copper,

silver, gold, palladium and platinum. Also with good stability of tungsten, molybdenum. 

Ceramic multilayer manufacturing process has a multi-layer sintering and thick-film 

multi-layer method. Simple process is as follows.

1. Single sintering multi-layer method

A ceramic blank forming a printed conductive layer of a laminated or printed insulation layer of 

a punching a precious metal sintering.

2. Thick film multilayer method

A ceramic blank, a sintered printed conductive layer, a sintered printed insulating layer, 

a printed conductive layer, and sintered layers.

Ceramic printing mostly as a thick film and thin film circuits and hybrid circuit boards for 

automotive engine control circuits, video recorders, VCD and other devices as a power supply, 

heating element part of the circuit board. Most of such printed circuit board containing 

resistors and other components, it can also be used as multi-chip circuit package and electrical 

tuner board.