High Frequency FPC Applications

High Frequency FPC Applications

With the development of FPC products, more and more customers pay more attention to the flexible board. We XD are professional and experienced in FPC board production. Here we are glad to introduce the our company fpc technology to you for a clear knowledge.

XD Three basic steps before production by engineers:

Firstly, it is the FPC board engineering assessment, mainly to assess whether or not the customer's FPC board are able to be produced;Whether or not the our production capacity and cost could meet the customer's board need.

Secondly, if the project assessment passed, then we will immediately arrange the materials to supply each production process.

Finally, our engineers will deal with customer’s engineering documents such as CAD drawings and gerber files to suit the production environment and production specifications of production equipment. Then they will distribute the production drawings, MI (Engineering Process Cards), and other files to the Production Department,Quality Control department, Purchasing department, and other concerned departments, to start the FPC board production.

XD Production Process

Double Layers FPC board

Cutting → Drilling → PTH → Plating → Pretreatment → Dry film Lamination → Alignment → Exposure → Develop → graphic plating → Stripping → Surface finsih → Cover Layer → Pressing → Curing → nickel-gold plated → Slik screen → Shearing → Electrical Test → Die Cutting → Final Inspection → Packaging → Shipping

Single Layer FPC Board

Cutting → Drilling → Dry film Lamination → Alignment → Exposure → Develop → Etching → Stripping →Surface Finish → Cover Layer →Pressing → Curing → nickel-Gold plated → Slik Screen → Shearing → Electrical Test → Die Cutting → Final Inspection → Packaging → Shipping

FPC Characters(Advantage)

1. Shorter: cut the assembly working-time.

Eliminate the connecting work of redundant cables.

2. Smaller:smaller than the PCB size
Effectively reduce the product size,and increase the convenience of

carrying
3. Lighter: The weight is lighter than the PCB (Rigid board)
Largely reduce the product weight
4.Thiner: thinner than the PCB

FPC could apply on 3D package and dynamic flexible design.

FPC Basic Structure

1) Copper Film

2) Copper foil: Basically divided into electrolytic copper and rolled copper; common thickness: 1oz, 1 / 2oz, and 1/3 oz

3) Substrate film: Common thickness:1mil and 1 / 2mil

4) Glue (adhesive) thickness:customized

5) Cover film Protective film: surface insulation with common thickness of 1mil and 1 / 2mil.

6) Stiffener (PI Stiffener Film): Reinforcing the mechanical strength of FPC to facilitate the actual operation. Common thickness is 3mil to 9mil.

FPC board Application:

Mobile Phone, Computer and LCD display, Smart Watch, HDD(hard disk drive), Camera, Antenna,Printer,LEDs,Car,Military,Spaceflight,and so on.