FPC material introduction

Raw material

(1) There is a rubber material, there is no glue material; the copper on the material is divided into electrolytic copper and rolled copper, and the copper-free rubber rolled material has flexibility and better folding performance.

(2) Material thickness: PI + copper thickness

2. Cover film

The cover film consists of PI and glue.

3. Strengthen

Reinforcing materials typically have the following types: PI enhancement, PED enhancement, FR4 enhancement, steel plate reinforcement, etc., generally enhanced thickness, PI1 / 2 1/2, PI11, PI21, PI31 to PI91, PI. These two values represent the thickness of the PI and the glue. The thickness is in Mil. The thickness is based on customer requirements.

4. Pure rubber

Pure glue is mainly used for lamination and delamination of multi-layer boards, and also for bonding reinforcement.

5. Screen closed movie

It is mainly used as a signal screen and must be grounded.

6. Three M glue

Bonding reinforcement and fixing of FPC boards.