Common packaging form of LED chip

Soft packaging

The chip is directly bonded to a specific PCB board, connected into a specific character or display form through welding wires, and the LED chip and welding wires are protected with permeable resin and assembled in a specific shell. This type of encapsulation is often used in digital display, character display or dot display products.

Pin type packaging

The common one is to fix the LED chip on the 2000 series lead frame. After welding the electrode lead, it is sealed into a certain transparent shape with epoxy resin to become a single LED device. The pins or seals can be divided into Φ3 and Φ5 diameter packages according to the size of the outer shape. The characteristic of this kind of package is to control the distance between the chip and the light surface, you can obtain a variety of different light Angle: 15°, 30°, 45°, 60°, 90°, 120°, etc., also can obtain the requirements of side light, relatively easy to automate production.

SMT packaging

The LED chip is bonded to the micro lead frame. After the electrode leads are welded, the smooth surface is usually sealed with epoxy resin after injection molding.

Double in-line package

Encapsulated with similar IC lead frame copper fixed chip, and after welding electrode wire with epoxy coating, common different bottom cavity "piranha" and super piranha type packaging, the packaging chip has good heat loss, low thermal resistance, LED the power can reach 0.1 W to 0.5 W input is greater than the pin type device, but the cost is higher.

Power type package

Power LED packaging forms are also many, it is characterized by the bonding chip bottom cavity is large, and has the ability of mirror reflection, high thermal conductivity, and has a low enough thermal resistance, so that the heat in the chip is quickly LED out of the device, so that the chip and the ambient temperature maintain a low temperature difference.

The above five LED mainstream packaging forms are the mainstream packaging methods commonly used in the current field. Understanding these packaging methods will help designers to understand the LED, so as to complete the related design more quickly and accurately.