Analysis of the main factors leading to the leakage, offset, side parts and damage of the chip components

First, the main factors that lead to the leakage of the patch are mainly the following:

1. There is no solder paste or solder paste on the pad of the board.

2, the component feeder (feeder) feed is not in place.

The air passage of the component nozzle is blocked, the nozzle is damaged, and the nozzle height is incorrect.

4, the board is poorly received, resulting in deformation.

5, human factors accidentally knocked out.

6, component quality problems, the thickness of the same variety is inconsistent.

7, the device's vacuum gas path failure, jam.

8, the placement machine calls the program for errors or omissions, or the selection of the component thickness parameters is incorrect during programming.

Second, the main factors leading to damage during component placement

1. When the placement machine is programmed, the Z-axis coordinates of the components are incorrect.

2, the positioning thimble is too high, so that the position of the circuit board is too high, the components are squeezed when placed.

The nozzle spring of the placement head is stuck.

Third, the main factors leading to component patch bias

1. When the placement machine is programmed, the X-Y coordinate of the component is incorrect.

2, the reason for the patch nozzle, so that the suction is unstable.

Fourth, the main factors leading to the flipping and side parts of the SMC resistor patch

1, the height of the head picking is wrong.

2, component feeder (feeder) feeding abnormal.

3, the height of the nozzle of the placement head is wrong.

4. When the bulk material is placed in the braid, the direction is reversed.

5. The size of the loading hole of the component tape is too large, and the component is flipped due to vibration.