2L Carbon PCB, OSP 1.6mm 35UM
Product Details
Key Specifications/Special Features:
Number of layer: double side PCB
Material: FR-4, CEM-3, High Tg, aluminum, halogen-free
PCB thickness:
Min thickness is 0.2mm (8mil)
Max thickness is 3.2mm (128mil)
Surface finished:
Gold plating, immersion gold (silver), HAL lead-free
Hot air solder leveling (HASL), Entek coating (OSP)
Soldermask: green, white, black, yellow, red, blue
Other printing: gold finger, carbon print, peelable mask, solder mask plugged hole
Copper thickness: 1/2oz (18μm) - 4oz (140μm)
Min finished hole size: 0.25mm (12mil)
Hole size tolerance (PTH): +/-0.076mm (3 mil)
Hole size tolerance (NPTH): +/-0.05mm (2 mil)
Min line width and spacing: 0.10mm (4 mil)
Min solder mask clearance : 0.076mm (3 mil)
Min annular ring: 0.1mm (4mil)
Profile and V-cut: CNC-routing, stamping and beveling, V-cut, CNC
Special process: micro-section, chamfer for gold finger
Primary Competitive Advantages:
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Brand-name Parts
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Country of Origin
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Distributorships Offered
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Electronic Link
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Experienced Staff
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Form A
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Green Product
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Guarantee/Warranty
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International Approvals
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Military Specifications
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Packaging
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Price
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Product Features
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Product Performance
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Prompt Delivery
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Quality Approvals
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Reputation
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Service
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Small Orders Accepted
Main Export Markets:
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Asia
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Australasia
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Central/South America
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Eastern Europe
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Mid East/Africa
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North America
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Western Europe
Payment Details:
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Payment Method:Telegraphic Transfer in Advance (Advance TT, T/T)
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Minimum Order:1 Pieces
Delivery Details:
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FOB Port:Shanghai
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FOB Range: US$ 1 per unit (Pieces)
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Lead Time: 3 - 7 days
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