Zirconia Toughened Alumina Copper Lamination Voltage Regulation System Ceramic PCB Assembly

• Product Details

Specifications of Ceramic PCB:

Why Ceramic PCB has such excellent performance? 

You can have a brief view on its basic structure and then you will understand.

• 96% or 98% Alumina (Al2O3), Aluminum Nitride (AIN), or Beryllium Oxide (BeO)

• Conductors material: For thin, thick film technology, it'll be silver palladium (AgPd), gold pllladium (AuPd); For DCB (Direct Copper Bonded) it'll be copper only

• Application temp: -55~850C

• Thermal conductivity value: 24W~28W/m-K (Al2O3); 150W~240W/m-K for AIN , 220~250W/m-K for BeO;

• Max compression strength: >7,000 N/cm2

• Breakdown Voltage (KV/mm): 15/20/28 for 0.25mm/0.63mm/1.0mm respectively

• Thermal expansion conefficient(ppm/K): 7.4 (under 50~200C)

Introduction:

Our factory is engaged in PCB/PCBA manufacturing and offering different kinds of board service. High reliability, strong diversity and expert advice are our characteristics. Please contact us if you have inquiry.

Ceramic PCBA board application:

1. electric power electronic control module;

2. high insulation & high pressure device

3. high temperature (up to 800C)

4. high power LED

5. High Power semiconductor modules

6. solid state relay (SSR)

7. DC-DC module power sources

Our advantage:

1. Lower expansion coefficient

2. Good thermal properties

3. Superior high frequency performance

4. Lower system cost: reduces test, insertion, assembly

Our process:

Ceramic substrate development trend: 

With the rapid development of led industry, the integrated development of high power density products is becoming market-oriented, and the ceramic substrate industry is also heating up rapidly.

Currently, there are two kinds of led heat dissipation substrates in the market: metal and ceramic substrates. Among them, the majority of led products use metal substrates, because the material of metal substrates is mainly aluminum or copper, with low cost and mature technology. Ceramic substrate is the circuit board of ceramic material with high heat dissipation and chemical stability.

In existing aluminum plate thermal conductivity and insulation meets the requirement of high power products, under the condition of existing high thermal conductive ceramic PCB can meet the requirements of such designs, ceramic and metal thermal contrast, because of the new thermal conductive materials and internal structure, thus eliminating the aluminum metal substrates have various defects, thereby greatly improving the overall heat dissipation effect of substrate.

It is reported that the current ceramic substrate refers to the high temperature copper foil directly bonded to aluminum nitride (aln) or alumina (al2o3) ceramic substrate surface (single or double) on the special process plate. The ultra-thin composite substrate made by this process has excellent electrical insulation performance, high thermal conductivity, high adhesion strength and excellent soft brazing, and can etch a variety of patterns, with strong current carrying capacity.

At the same time, ceramic substrate has become the basic material of interconnection technology and high-power power electronic circuit structure, and is gradually replacing aluminum substrate.

Our products:

Contact: Sunny

Tel: +86-0755-29621535 EXT 822

Mol/whatapp: +86-18038188954

Skype: 594432891@qq.com

Email:  sales7@xdpcba.com

• 

  CEM-1 Electric Door Remote Control Carbon oil PCB ci...

• 

  High Resistance Carbon FPC

• 

  FR4 Voltage DIVider Carbon Ink Circuit Board Assembly

• 

  FR4 Potentiometer High Resistance Carbon Ink PCB

• 

  FR4 Sensor Carbon Ink PCB

• 

  2 layers View Mirror Controller Carbon Ink PCB