1.0mm Ceramic Circuit Board ENIG alumina circuit board High frequency and high speed printed circuit board ceramic pcb board
Alumina, double-sided conductive metallization, substrate thickness 1.0mm, 10Z copper thickness, nickel-plated gold, characteristic impedance 50Ω, differential impedance 100Ω.
Surveying and mapping componentized fpc flexible fpcb circuit board circuit pcb blank circuit boards


Specification
High-frequency, high-speed circuit substrate
Alumina, double-sided conductive metallization, substrate thickness 1.0mm, 10Z copper thickness, nickel-plated gold, characteristic impedance 50Ω, differential impedance 100Ω.
--Written by Miya-250729

| Value | Specification |
PCB Max. size | 510mm*1200mm(SMT) |
| Remarks | High Tg CCL is Available(Tg>=180℃) |
| Finish Board Thickness | 0.2 mm-6.00mm(8mil-126mil) |
| Surface Finish | Gold finger(>=0.13um), Immersion Gold(0.025-0075um), Plating Gold(0.025-3.0um), HASL(5-20um), OSP(0.2-0.5um) |
| Shape | Routing、Punch、V-cut、Chamfer |
| Surface Treatment | Solder Mask(black, green, white, red, blue, thickness>=12um, Block, BGA) |
| Silkscreen(black, yellow, white) | |
| Peel able-mask(red, blue, thickness>=300um) | |
| Minimum Core | 0.075mm(3mil) |
| Copper Thickness | 1/2 oz min; 12oz max |
| Min Trace Width & Line Spacing | 0.075mm/0.1mm(3mil/4mil) |
| Min Hole Diameter for CNC Drilling | 0.1mm(4mil) |
| Min Hole Diameter for Punching | 0.6mm(35mil) |
| Biggest panel size | 610mm * 508mm |
| Hole Position | +/-0.075mm(3mil) CNC Drilling |
| Conductor Width(W) | +/-0.05mm(2mil) or +/-20% of original |
| Hole Diameter(H) | PTHL:+/-0.075mm(3mil) |
| Non PTHL:+/-0.05mm(2mil) | |
| Outline Tolerance | +/-0.1mm(5mil) CNC Routing |
| Warp & Twist | 0.70% |
| Insulation Resistance | 10Kohm-20Mohm |
| Conductivity | <50ohm |
| Test Voltage | 10-300V |
| Panel Size | 110 x 100mm(min) |
| 660 x 600mm(max) | |
| Layer-layer misregistration | 4 layers:0.15mm(6mil)max |
| 6 layers:0.25mm(10mil)max | |
| Min spacing between hole edge to circuitry pattern of an inner layer | 0.25mm(10mil) |
| Min spacing between board outline to circuitry pattern of an inner layer | 0.25mm(10mil) |
| Board thickness tolerance | 4 layers:+/-0.13mm(5mil) |
Ceramic PCB Tech Specification
Property | Unit | Alumina Ceramic (Al2O3) | Aluminum Nitride (AlN) | Test Standard |
Composition | % | Al2O3 ≥ 96 | AlN ≥ 96% | GB/T 5231 |
Appearance | / | White | Gray | 3.2 |
Thickness | mm | 0.25 ~ 2.0 | 0.38 ~ 1.5 | IPC-TM-650 |
Dimensions (L*W) | mm | 100*100 ~ 140*190 | 50*50 ~ 127*127 | IPC-TM-650 |
Density | g/cm³ | ≥ 3.7 | ≥ 3.33 | GB/T 2413 |
Water Absorption | % | 0 | 0 | IPC-TM-650 |
Thermal Conductivity (20°C) | W/(m·K) | ≥ 20 | ≥ 170 | GB/T 5598 |
Flexural Strength | MPa | ≥ 350 | ≥ 450 | GB/T 5593 |
Volume Resistivity (20°C) | Ω·cm | ≥ 1014 | ≥ 1013 | GB/T 5594 |
Dielectric Constant (1MHz) | / | 9 ~ 10 | 8 ~ 10 | IPC-TM-650 |
Dielectric Loss (1MHz) | / | ≤ 3*10-4 | ≤ 4.5*10-4 | IPC-TM-650 |
PCB Assembly(SMT) Product Capacity
| Value | SMT Capacity |
| PCB Max. size | 510mm*1200mm(SMT) |
| Chip component | 01005,0201, 0402, 0603, 0805, 1206 package |
| Min.pin space of IC | 0.1mm |
| Min. space of BGA | 0.1mm |
| Max.precision of IC assembly | ±0.01mm |
| Surface Treatment | ≥8 million pionts/day |
| 6 DIP production lines | |
| Assembly testing | Current test, voltage test, high temperature and low temperature test. |
| Drop Impact Test,aging test,water proof test,leakage-proof test and etc. | |
| Different test can be done according to your requirement. |









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A: Xing Da Electronic Technology Co., ltd is leading OEM PCB&PCBA manufacturer in China with over 14 years rich experience. Our aim is “One-Stop service, smart manufacturing, make your production easier.”
Q2: What is needed for quotation?
A:1. PCB&FPC
We need Gerber files and specification for quotation
2. PCBA (= PCBA+ components + Assembly)
For PCBA, please send Gerber files, specification and Bom list for factory price.
A: We respect customer's design authority and will never manufacture PCB or PCBA for someone else without your permission. We never share customer documents with third parties.NDA is acceptable.
Q4:What payment do you accept ?
A: T/T,Western Union,Paypal, L/C,Credit Card, Cheque,Others
A: 1. We have our own forwarders to ship goods with competitive price by DHL, UPS, FEDEX, TNT,EMS etc. We can also arrange shipments via sea or air depending on your specific requirements."
2. If you have your own forwarder, we can cooperate with them.
Q6: How about the MOQ?
A: There is no MOQ. We can produce prototypes, small orders, or large volumes.