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multilayer pcb pcb assembly

Multilayer HDI PCB with SMT Assembly PCB Board

ALPCB052
PCB Manufacturing manufacturer / supplier in China, offering Multi-layer DIP PCB with SMT Assembly PCB Board, Electricsmart Motor Protection Controller with Relay Protection Output Method, AC Motor Speed Controller DC Motor Controller 48V and so on.
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Multilayer HDI PCB with SMT Assembly PCB Board

Introduction

We also have ability for PCB layout ,PCBA and Circuit assembly, specializes in producing the various electronic products based on your customized designs and do pcba, pcb assembly for all kinds of small ,medium Volume electronic products
Enabling you to focus on product development and sales, we can solve your production technology issues and take care of product quality.
The operation we can handle for you is from the Bare pc board fabrication, full component procurement, SMT/BGA/DIP assembly, mechanical/case assembly, rubber molding, functional testing, repair, inspection of finished goods to shipment arrangement

Product Description

Supply OEM Electronic circuit board assembly with high quality
Material : FR4 94v0 tg-130
Layers (GERBER FILE) : 2 layers
Board Thickness : 1.6mm
Copper Thickness : 2oz
Surface Treatment :HASL-LF
Solder Mask : green
Silk Screen : white
Data File Format : gerber file andbill of material BOM
Board size: 200*105mm
Min. Hole Size : 0.15mm
Hole Size Tolerance : +/-0.05mm (2 mil)
Profile and V-Cut : v cut
Special Process : Embedded Capacity

PCB Assembly Details:

  • Standard Component Sourcing Service
    Supplier →Components Purchase →IQC →Protection Control →Material Supply →Firmware
     

  • Technical Requirement for PCB Assembly:
    Professional Surface-mounting and Through-hole soldering Technology
    Various sizes like 1206,0805,0603,0402,0201 components SMT technology
    ICT(In Circuit Test),FCT(Functional Circuit Test) technology.
    PCB Assembly With UL,CE,FCC,Rohs Approval
    Nitrogen gas reflow soldering technology for SMT.
    High Standard SMT&Solder Assembly Line
    High density interconnected board placement technology capacity.
     

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