Alumina Substrates Silver Paste Oscilloscope Pottery Printed Circuit Board
XingDa PCB offers pottery/ceramic printed circuit boards for your PCB needs. Many users of printed circuit boards find ceramic boards have an advantage over traditional boards made of other materials. This is because they provide suitable substrates for electronic circuits that have high thermal conductivity and a low expansion coefficient (CTE).
The multilayer ceramic PCB is extremely versatile and can replace a complete traditional printed circuit board with a less complex design and increased performance. You can use them for high-power circuits, chip-on-board modules, proximity sensors, and more.
Besides its enviable thermal properties and expansion coefficient, ceramic boards work at operating temperatures up to 350 degrees Celsius, creating a smaller package size, offer better high-frequency performance, and can come in hermetic packages for no water absorption.
Using ceramic PCBs can also result in a lower overall system cost and be especially cost-effective for dense packages since you have parallel layers processing.
Pottery Printed Circuit Board Capability:

Why Ceramic PCB has such excellent performance?
96% or 98% Alumina (Al2O3), Aluminum Nitride (AIN), or Beryllium Oxide (BeO)
Conductors Material: For thin, thick film technology, it'll be silver palladium (AgPd), gold palladium (AuPd); For DCB (Direct Copper Bonded) it'll be copper only
Application temp: -55~850C
Thermal conductivity value: 24W~28W/m-K (Al2O3); 150W~240W/m-K for AIN , 220~250W/m-K for BeO;
Max compression strength: >7,000 N/cm2
Breakdown Voltage (KV/mm): 15/20/28 for 0.25mm/0.63mm/1.0mm respectively
Thermal expansion coefficient(ppm/K): 7.4 (under 50~200C)
Application of Ceramic PCB
high-accuracy clock oscillator, voltage controlled oscillator (VCXO), temperature compensated crystal oscillators (TCXOs), oven-controlled crystal oscillators (OCXOs);
Semiconductor cooler;
electric power electronic control module;
high insulation & high-pressure device;
high temperature (up to 800C)
high power LED
High Power semiconductor modules
solid state relay (SSR)
DC-DC module power sources
electric power transmitter modules
Solar-panel arrays
Our services:
One-stop OEM ODM PCB/PCBA manufacturer
We are a professional manufacturer in various Ceramic PCB/PCBA and Carbon PCB/PCBA with 11 years of experience, we can provide a reasonable price with high-quality products.

SMT Capacity | |
SMT Item | Capacity |
PCB Max. size | 510mm*1200mm(SMT) |
Chip component | 1206 0805 0603 0402 0201 package |
Min. pin space of IC | 0.1mm |
Min. space of BGA | 0.1mm |
Max. precision of IC assembly | ±0.01MM |
Assembly capacity | ≥8 million piots/day |
DIP capacity | 6 DIP production lines |
Assembly testing | Bridge test,AOI test, X-Ray test, ICT(In-Circuit Test),FCT (Functional Circuit Test) |
| Current test, voltage test, high temperature and low temperature test, Drop Impact Test,aging test, waterproof test,leakage-proof test and etc. Different tests can be done according to your requirement. |

