BGA pcb manufacturing for smart pcb projects
PCB-4
BGAAdvantages are high density, low thermal impedance and low inductance pin. Disadvantages are non-ductility, difficulty in inspection, difficulty in developing circuit and high cost.
According to different packaging materials, BGA components mainly include the following: plastic BGA, ceramic BGA, ceramic column BGA, tape BGA and chip scale package.
According to different packaging materials, BGA components mainly include the following: plastic BGA, ceramic BGA, ceramic column BGA, tape BGA and chip scale package.
Quantity:
US $0.00
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BGA pcb manufacturing for smart pcb projects pcb companypcb manufacturingpcb companypcb manufacturing
Welcome to XingDa Electric Technology Co.,Ltd
pcb companypcb manufacturingpcb companypcb manufacturing pcb companypcb manufacturingpcb companypcb manufacturing pcb companypcb manufacturingpcb companypcb manufacturing pcb companypcb manufacturingpcb companypcb manufacturi
Remove components and re-solder if necessary. It's more complicated than before, and the rework and hand soldering of the BGA package is the hardest part.
1. Remove BGA pcb companypcb manufacturingpcb companypcb manufacturing
Clean residual solder from PCB pads. Do not damage the pads and solder mask during operation.
2. Remove moisture pcb companypcb manufacturingpcb companypcb manufacturing
Because BGAs are sensitive to moisture, check the device for moisture before assembly.
3. Printing solder paste pcb companypcb manufacturingpcb companypcb manufacturing
BGA Rework has to choose a small template for BGA because other components are already installed on the surface. The thickness and opening size of the template should be determined according to the ball diameter and ball distance. After printing, be sure to check the print quality. For CSPs with a ball pitch below 0.4mm, solder paste cannot be printed and directly applied to the PCB pads.
4. Clean the pads.
Use a soldering iron to clean up any residual solder from the PCB pads and level them. Use the removal strip and a flat flat soldering iron tip to clean it up. Do not damage the pads and solder mask during operation.
5. Remove the moisture again and print the solder paste again
6. Install BGA
Place the surface mount board printed with solder paste on the workbench, then select the appropriate nozzle and turn on the vacuum pump. Suck up the BGA device, move the suction nozzle down after the bottom of the BGA device and the PCB pads are completely overlapped, stick the BGA device on the PCB, and then turn off the vacuum pump.
7. Reflow soldering.
Set the soldering temperature according to specific conditions such as device size, PCB thickness, etc. Compared with traditional SMD, the soldering temperature of BGA is about 15 degrees higher.
8. Check
Pick up the soldered BGA pcb assembly board, observe the light around the BGA, observe whether the light is transparent, whether the distance between the BGA and the PCB is the same, whether the solder paste is completely melted, whether the solder balls are in the correct shape, and whether the solder balls are collapsed degree, etc.
Specification
Products Application
Welcome to XingDa Electric Technology Co.,Ltd
pcb companypcb manufacturingpcb companypcb manufacturing pcb companypcb manufacturingpcb companypcb manufacturing pcb companypcb manufacturingpcb companypcb manufacturing pcb companypcb manufacturingpcb companypcb manufacturi
Remove components and re-solder if necessary. It's more complicated than before, and the rework and hand soldering of the BGA package is the hardest part.
1. Remove BGA pcb companypcb manufacturingpcb companypcb manufacturing
Clean residual solder from PCB pads. Do not damage the pads and solder mask during operation.
2. Remove moisture pcb companypcb manufacturingpcb companypcb manufacturing
Because BGAs are sensitive to moisture, check the device for moisture before assembly.
3. Printing solder paste pcb companypcb manufacturingpcb companypcb manufacturing
BGA Rework has to choose a small template for BGA because other components are already installed on the surface. The thickness and opening size of the template should be determined according to the ball diameter and ball distance. After printing, be sure to check the print quality. For CSPs with a ball pitch below 0.4mm, solder paste cannot be printed and directly applied to the PCB pads.
4. Clean the pads.
Use a soldering iron to clean up any residual solder from the PCB pads and level them. Use the removal strip and a flat flat soldering iron tip to clean it up. Do not damage the pads and solder mask during operation.
5. Remove the moisture again and print the solder paste again
6. Install BGA
Place the surface mount board printed with solder paste on the workbench, then select the appropriate nozzle and turn on the vacuum pump. Suck up the BGA device, move the suction nozzle down after the bottom of the BGA device and the PCB pads are completely overlapped, stick the BGA device on the PCB, and then turn off the vacuum pump.
7. Reflow soldering.
Set the soldering temperature according to specific conditions such as device size, PCB thickness, etc. Compared with traditional SMD, the soldering temperature of BGA is about 15 degrees higher.
8. Check
Pick up the soldered BGA pcb assembly board, observe the light around the BGA, observe whether the light is transparent, whether the distance between the BGA and the PCB is the same, whether the solder paste is completely melted, whether the solder balls are in the correct shape, and whether the solder balls are collapsed degree, etc.
Specification
| Materials | FR4, (High Tg FR4, General Tg FR4, Middle Tg FR4), Lead-Free Solder Sheet, Halogen Free FR4, Ceramic Filling Material, Teflon, PI Material, BT Material, PPO, PPE etc. |
| Board thickness | Mass production: 394mil(10mm) Samples: 17.5mm |
| Surface finish | HASL, Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger |
| Layer | Mass production: 2~58 layers / Pilot run: 64 layers, Flexible PCB: 1-12 Layers |
| Min hole size | Mechanical drill: 8mil(0.2mm) Laser drill: 3mil(0.075mm) |
| PCBA QC | X-ray, AOI Test, Functional Test |
| Special Process | Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, and Resistance control. |
| Our service | PCB, Turnkey PCBA, PCB Clone, Housing, PCB Assembly, Component sourcing, PCB manufacturing from 1 to 64 layers |
| Sanforized | Buried via, Blind via, Mixed Pressure, Embedded Resistance, Embedded Capacitance, Local Mixed Pressure, Local High Density, Back drill, impedance control. |
| SMT Capacity | 700Million Points/Day |
| DIP Capacity | 0.5Million Points/Day |
Products Application
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