4 layer pcb high impedance pcb board

4 Layer PCB  Capability :

Provide free DFM Checking , We can suggest 4 layer PCB stack-up

Copper Thickness:  Max to 6 oz inner copper, 12 oz outer copper

Min Hole: 0.15mm by mechanical drilling    0.1mm by laser

PCB Thickness :0.4mm – 6.5mm

Surface Process: Immersion gold ,HASL-LF,Hard Gold,Immersion Tin

Soler Mask: Green Yellon White Black or custom

Silkscreen: White Black Yellow or custom

Accept 4 layer PCB with Blind or buried hole

100% Testing

How to Design a 4 Layer PCB Board

1. 4 Layer PCB Layer-out Guidance

Generally speaking, 4 layer circuit board includes the top layer, bottom layer, and two middle layers. The top and bottom layers are lay out with signal lines. The middle layer first uses the command DESIGN/LAYER STACK MANAGER to add INTERNAL PLANE1 and INTERNAL PLANE2 with ADD PLANE as the most used power layers such as VCC and ground layers such as GND that is, connect the corresponding network labels. Please note: you should not use ADD LAYER. This will increase MIDPLAYER, which is mainly used for multi-layer signal line placement.

PLANE1 and PLANE2 are two layers of copper connecting the power supply VCC and the ground GND. If there are multiple power sources such as VCC2 or GND2, first use a thicker wire in PLANE1 or PLANE2 or FILL. At this time, the wire or the corresponding copper ground is not visible, and the wire or filling can be clearly seen against the light.

To delimit the power or ground plane (mainly for the convenience of the PLACE/SPLIT PLANE command later), use PLACE/SPLIT PLANE to delimit the area in the corresponding areas of INTERNAL PLANE1 and INTERNAL PLANE2. VCC2 copper and GND2 copper should not be in the same PLANE as VCC. Please note that different network surface layers in the same PLANE should not overlap if possible.

Suppose SPLIT1 and SPLIT2 overlap in the same PLANE (SPLIT2 is inside SPLIT1). The two pieces are automatically separated according to the SPLIT2 border (SPLIT1 is distributed on the periphery of SPLIT). Pay attention to the pads or vias of SPLIT1 when overlapping; don’t try to connect SPLIT1 to the area of SPLIT2. At this time, the via holes in this area are automatically connected to the corresponding copper in the same layer. The DIP footprint components and plug-in parts that pass through the top and bottom boards will automatically get away from the PLANE in this area. Click DESIGN/SPLIT PLANES to view each SPLIT PLANES.

4 layer pcb high impedance pcb board pcb layout

The Layer Setting and the Division of the Internal Electric Layer of Protel99

There are two types of electrical layers in PROTEL99. Open a PCB design file and press the shortcut key L, and the layer setting window appears. The one on the left (SIGNAL LAYER) is the positive layer, including TOP LAYER, BOTTOM LAYER, and MID LAYER. The one in the middle (INTERNAL PLANES) is the negative layer, also called the INTERNAL LAYER.

These two layers have different properties and usage methods. The positive layer is generally used for pure track lines, including outer and inner lines. The negative film layer is mostly used as a ground and power layer. In the multi-layer PCB board, the ground and power layers generally use the whole piece or several large copper partitions for the circuit. You must lay copper if you use the MID LAYER, also known as the positive layer. Paving copper will make the entire design data volume very large, which is not conducive to data communication and transmission, and will affect the design refresh speed. With negative film, you only need to create a THERMAL PAD at the junction of the outer and inner layers, which is very beneficial for design and data transmission.

Add and Delete Inner Layer4 layer pcb high impedance pcb board pcb layout

In design, there are instances where it will need to add or delete layers. For example, the double-sided board is changed to a four-layer board, or the four-layer board with higher signal requirements is upgraded to a six-layer board, and so on. If you need to add an electrical layer, you can follow the steps below:

In the DESIGN-LAYER STACK MANAGER, there is a schematic diagram of the current stack structure on the left. Click the upper layer where you want to add a new layer, such as TOP, and then click ADD LAYER (positive film) or ADD PLANE (negative film) on the right to complete the addition of the new layer. If the new layer is a PLANE (negative film) layer, you must assign the corresponding network to the new layer by double-clicking the layer name.

There can only be one network assigned. Generally, a GND is sufficient for the ground layer. If you want to add a new network to this layer, such as a power layer, it can only be achieved by internal segmentation in the subsequent operations. Therefore, you first have to allocate a network with a large number of connections.

If you click ADD LAYER, a MID LAYER (positive film) will be added, and the application method is the same as the outer circuit. Suppose you want to apply a mixed electrical layer with both wiring and a large copper surface for power. In that case, you must use the positive layer generated by ADD LAYER to design (see the reason below).

4 layer pcb high impedance pcb board pcb layout

Slip of the Inner Electrical Layer

If several groups of power supplies are in the design, you can use inner layer division in the power layer to distribute the power network. The command to be used here is PLACE-SPLIT PLANE. Then set the layer in the dialog box that appears, specify the network to be allocated for the split at CONNECT TO NET, and place the split area according to the copper paving method.

After the placement is complete, the holes with the corresponding network in this segmented area will automatically generate flower hole pads, which completes the electrical connection of the power layer. You can repeat this step until all power is allocated. When the inner electric layer needs to allocate more networks, it is more troublesome to divide the inner layer and require proper experience.

There is also a problem to be noted here: Excluding PLACE FILL, there are two electrical connection methods for large copper in PROTEL. The first is POLYGON PLANE or ordinary copper paving. This command can only be applied to the positive layer, including TOP /BOT/MID LAYER. The other is SPLIT PLANE or the internal electrical layer division. This command can only be applied to the negative film layer or INTERNAL PLANE. Attention should be paid to distinguish the scope of use of these two commands. Modify the command of split copper plating is EDIT-MOVE-SPLIT PLANE VERTICES.

• 4 layer pcb high impedance pcb board pcb layout

Our Services4 layer pcb high impedance pcb board pcb layout

Our factory4 layer pcb high impedance pcb board pcb layout

FAQ4 layer pcb high impedance pcb board pcb layout

Packaging & Shipping4 layer pcb high impedance pcb board pcb layout