new PIC24HJ128GP202-E/SO original Fast delivery BOM list Quotation PIC24HJ128GP202-E/SO

PIC24HJ128GP202-E/SO

minimum order

1 piece

Country of Origin

Shenzhen

Quantity:

$1.00 / piece

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Model Number:PIC24HJ128GP202-E/SO
Type:microcontroller
Place of Origin:China
Brand Name:original
D/C:newest
Interface:Internal
Packaging:Tube
Core processor:PIC
Speed:40 MIP
Connectivity:I²C, IrDA, LINbus, PMP, SPI, UART/U
Peripherals:Brownout Detect/Reset, DMA, POR, PWM
Number of I/Os:21
Program storage capacity:128KB (43K x 24)

new PIC24HJ128GP202-E/SO original Fast delivery BOM list Quotation PIC24HJ128GP202-E/SO

Welcome to XingDa Electric Technology Co.,Ltd

Xindaxing Electric Technology Co.,LTd

Parameters:

Parameter item	Parameter value
Part Number	PIC24HJ128GP202-E/SO
Minimum Quantity	1500
Description	IC MCU 8BIT 8KB FLASH 32LQFP
Category	Electronic Components, Accessories & Telecommunications>>Other Electronic Components
Minimum Quantity	1500
Packaging	Tray
Series	STM8L EnergyLite
Core Processor	STM8
Core Size	8-Bit
Speed	16MHz
Connectivity	I²C, SPI, UART/USART
Peripherals	Infrared, POR, PWM, WDT
Number of I/O	30
Program Memory Size	8KB (8K x 8)
Program Memory Type	FLASH
EEPROM Size	2K x 8
RAM Size	1.5K x 8
Voltage - Supply (Vcc/Vdd)	1.65 V ~ 3.6 V
Oscillator Type	Internal
Operating Temperature	-40°C ~ 85°C (TA)
Package / Case	32-LQFP

At present we have sufficient Nordic, ST TI , Microchip NXP ON chips in stock!!! We can also provide a series of other chips, end customers in need can contact at any time!

We only provide components to final customerswho need PCBA or electroniccomponents , anddo not sell to traders, component distributors, please do not disturb, only provide end customers with scarce chip resources!

Our Services:

We are a professional PCBA manufacturer, and provide customers with a complete set of OEM and EMS services.

PCB Assembly (SMT) Product Capacity:

SMT Capacity
SMT Item	Capacity
PCB Max. size	510mm*1200mm(SMT)
Chip component	0201, 0402, 0603, 0805, 1206 package
Min.pin space of IC	0.1mm
Min. space of BGA	0.1mm
Max.precision of IC assembly	±0.01mm
Assembly capacity	≥8 million piots/day
DIP capacity	6 DIP production lines
Assembly testing	Bridge test,AOI test, X-Ray test, ICT(In Circuit Test),FCT(Functional Circuit Test)
FCT(Functional Circuit Test)	Current test, voltage test, high temperature and low temperature test,Drop Impact Test,aging test,water proof test,leakage-proof test and etc.Different test can be done according to your requirement.