Smt Smd Pcba
XDCPCB111
Shenzhen Xin Da Electronic Tech Co.,Ltd is a smt smd pcb board assemble oem manufacture and provide electrical pcba pcb assembly service. Our company have more than 10years’experience in smt smd pcba. We have wave soldering machines, SMT machines and other the most advanced equipment to ensure productions’ efficiency and quality. Due to our high quality circuit board assembly we are also trusted by our customers as a circuit board SMT & SMD service reliable provider.
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PCB Assembly SMT & SMD manufacturing Capabilities
-Quantity: Prototype, Low, Medium, High Volume PCB Assembly
-Type of Assembly: SMT, Thru-hole, Cable assembly, Wire Harness
-Min. IC Pitch: 0.30mm
-Foot Pin: SO, SOP, SOJ, TSOP, TSSOP, QFP, BGA and U-BGA
-Min. Chip Placement: 1005
-Max. PCB Size: 410 x 600mm
-Min. PCB Thickness: 0.35mm
-Maximum BGA Size: 74 x 74mm
-BGA Ball Pitch: 1mm ~ 3mm
-BGA Ball Diameter: 0.4mm ~ 1mm
-QFP Lead Pitch: 0.38mm ~ 2.54mm
-Solder Type: Water Soluble Solder, Lead-Free, Wave soldering
-Components: 1) Passive Down to 0201 size BGA and VFBGA
2) Leadless Chip Carriers/CSP/QFN
3) Double-sided SMT Assembly
4）Fine Pitch to 0.8mils
5）BGA Repair and Reball
6）Part Removal and Replacement
-File Format:
1) Bill of Materials
2) Gerber files
3) Pick-N-Place file
-Types of Service: Turn-key, Partial turn-key or consignment, pilot run
-Component packaging: Cut Tape, Tube ,Reels, Loose Parts
-Turn Time: Same day service to 15 days service
-Programing: Hex file or bin file firmware.
-Testing: Flying Probe Test, X-ray Inspection AOI Test
-Package: Anti-static Bubble Bag & Carton
-PCB assembly process: IQC for incoming materials checking----Material baking----SMT----- Semi-Products Testing & QC ---DIP parts -- IPQC--- Wave Soldering--Semi-Products Testing & QC-----Assembling-----ICT or Xray-----100% Function Testing-----Reliability Testing (burn-testing) - Package - Shipping
Product Description
Products application
-Household appliance
-Medical products
-Automotive products
-Industrial products
-Consumer electronics
Factory View
Packaging & Shipping
.Packaging Details: Inner packing: Vacuum packing / Plastic bag
.Outer packing: Standard carton packing (As per customer's requirements)
.Delivery Detail: 1-3weeks depends on quantity
.Shipping: As per customer's requirements
-Quantity: Prototype, Low, Medium, High Volume PCB Assembly
-Type of Assembly: SMT, Thru-hole, Cable assembly, Wire Harness
-Min. IC Pitch: 0.30mm
-Foot Pin: SO, SOP, SOJ, TSOP, TSSOP, QFP, BGA and U-BGA
-Min. Chip Placement: 1005
-Max. PCB Size: 410 x 600mm
-Min. PCB Thickness: 0.35mm
-Maximum BGA Size: 74 x 74mm
-BGA Ball Pitch: 1mm ~ 3mm
-BGA Ball Diameter: 0.4mm ~ 1mm
-QFP Lead Pitch: 0.38mm ~ 2.54mm
-Solder Type: Water Soluble Solder, Lead-Free, Wave soldering
-Components: 1) Passive Down to 0201 size BGA and VFBGA
2) Leadless Chip Carriers/CSP/QFN
3) Double-sided SMT Assembly
4）Fine Pitch to 0.8mils
5）BGA Repair and Reball
6）Part Removal and Replacement
-File Format:
1) Bill of Materials
2) Gerber files
3) Pick-N-Place file
-Types of Service: Turn-key, Partial turn-key or consignment, pilot run
-Component packaging: Cut Tape, Tube ,Reels, Loose Parts
-Turn Time: Same day service to 15 days service
-Programing: Hex file or bin file firmware.
-Testing: Flying Probe Test, X-ray Inspection AOI Test
-Package: Anti-static Bubble Bag & Carton
-PCB assembly process: IQC for incoming materials checking----Material baking----SMT----- Semi-Products Testing & QC ---DIP parts -- IPQC--- Wave Soldering--Semi-Products Testing & QC-----Assembling-----ICT or Xray-----100% Function Testing-----Reliability Testing (burn-testing) - Package - Shipping
Product Description
Products application
-Household appliance
-Medical products
-Automotive products
-Industrial products
-Consumer electronics
Factory View
Packaging & Shipping
.Packaging Details: Inner packing: Vacuum packing / Plastic bag
.Outer packing: Standard carton packing (As per customer's requirements)
.Delivery Detail: 1-3weeks depends on quantity
.Shipping: As per customer's requirements
