Sensor PCBA
XDCPCB108
An Sensor is a device that senses a specified measurement and converts it into a usable signal according to a certain rule, usually consisting of a sensitive component and a conversion component. Sensor PCBA is widely used in automatic control like temperature, flow, pressure, thickness, tension, speed, position, frequency, phase, etc.
XD has great ability of providing the high quality sensor PCBA with cost effective price.
XD has great ability of providing the high quality sensor PCBA with cost effective price.
Quantity:
US $0.00
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The sensor is a detection device that can sense the measured information and can The detected information is transformed into an electrical signal or other required form of information output according to a certain rule to meet the requirements of information transmission, processing, storage, display, recording and control. It is the first step of automatic detection and automatic control.
Technical Detail for Sensor PCBA :
What we specialized at:
1. PCB development and design;
2. PCB manufacturing from 1 to 32 layers(Rigid PCB,Flexible PCB,Ceramic PCB,Aluminum PCB);
3. PCB Clone;
4. Component sourcing;
5. PCB Assembly;
6. Write program for customers;
7. PCB/ PCBA Test.
Related PCB:
PCBA Workshop
Exhibition
Technical Detail for Sensor PCBA :
| ITEM | Capability |
| Layers | 1-38 |
| Thicker Copper | 0.5-12OZ |
| Products Type | HF(High-Frequency)&(Radio Frequency) board, Impedance controlled board , HDI board ,BGA& Fine Pitch board |
| Solder Mask | Nanya&Taiyo ;LPI & Matt Red, green, yellow,white, blue,black. |
| Base material | FR4(Shengyi China、ITEQ, KB A+,HZ), HI-TG, FR06, Rogers,Taconic、Argon、Nalco、Isola and so on |
| Finished Surface | Conventional HASL,Lead-free HASL,Falsh Gold, ENIG (Immersion Gold)OSP(Entek), Immersion Tin,ImmersionSilver,Hard Gold |
| Selective Surface Treatment | ENIG(immersion Gold)+OSP, ENIG(immersion Gold)+Gold Finger,Flash Gold +Gold Finger, immersion Silver+ Gold Finger, Immersion Tin+Gold Finger |
| Technical Specification | Minimum line width/gap:3.5/4mil(laser drill) Minimum hole size:0.15mm(mechanical drill)/4mil(laser drill) Minimum Annular Ring: 4mil Max Copper thickness: 6OZ Max Production size:900×1200mm Board Thickness:D/S: 0.2-7.0mm, Multilayers:0.40-7.0mm, Min Solder Mask Bridge:0.08mm Aspect ratio: 15:1 Plugging Visa capability: 0.2-0.8mm |
| Tolerance | Plated holes Tolerance:0.08mm(min±0.05) Non-plated hole tolerance:0.05min(min+0/-0.05mm or +0.05/-0mm) Outline Tolerance:0.15min(min±0.10mm) Functional test : Insulating resistance : 50 ohms (mormality) Peel off strength: 1.4N/mm Thermal Stress test :2650c,20 seconds Solder mask hardness:6H E-Test voltage :500V+15/-0V 30S Warp and Twist: 0.7% (semiconductor test board≤0.3% ) |
What we specialized at:
1. PCB development and design;
2. PCB manufacturing from 1 to 32 layers(Rigid PCB,Flexible PCB,Ceramic PCB,Aluminum PCB);
3. PCB Clone;
4. Component sourcing;
5. PCB Assembly;
6. Write program for customers;
7. PCB/ PCBA Test.
Related PCB:
PCBA Workshop
Exhibition
