pcb layout bga 0.5mm
XDCPCB101
Soldering of BGA devices requires precise control and is usually done by automated processes. BGA devices are not suitable for socket mounting. XD has capacity and equipment to make high quality BGA PCBA.
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Technical Detail for BGA PCBA :
Advantages of BGA PCBA
High density
The BGA is a solution to the problem of producing a miniature package for an integrated circuit with many hundreds of pins. Pin grid arrays and dual-in-line surface mount (SOIC) packages were being produced with more and more pins, and with decreasing spacing between the pins, but this was causing difficulties for the soldering process. As package pins got closer together, the danger of accidentally bridging adjacent pins with solder grew.
Heat conduction
A further advantage of BGA packages over packages with discrete leads (i.e. packages with legs) is the lower thermal resistance between the package and the PCB. This allows heat generated by the integrated circuit inside the package to flow more easily to the PCB, preventing the chip from overheating.
Low-inductance leads
The shorter an electrical conductor, the lower its unwanted inductance, a property which causes unwanted distortion of signals in high-speed electronic circuits. BGAs, with their very short distance between the package and the PCB, have low lead inductances, giving them superior electrical performance to pinned devices.
Test Method for BGA PCBA:
By X-ray layering, the following four basic physical test parameters can be obtained at the BGA solder joint:
1. location of the center of the solder joint
The relative position of the center of the solder joint in different image slices indicates the positioning of the component on the printed circuit board pad.
2. weld point radius
The weld spot radius measurement indicates the corresponding amount of solder in the solder joint on a particular level, and the radius measurement at the pad layer indicates
Any changes in the solder paste-printing process and due to pad contamination, at the ball level
Radius measurements indicate the problem of coplanarity of solder joints across components or printed circuit boards.
3. Take a number of loops around the solder joint and measure the thickness of the solder on each loop.
Ring thickness measurements and their various rates of change, showing the distribution of solder within the solder joints, using these parameters to discriminate
It is particularly effective when the situation is good or bad and the gap exists.
4. the error of the shape of the weld point relative to the ring (also known as roundness)
The roundness of the solder joints shows the symmetry of the solder distribution around the solder joints, which reflects alignment and wetting with the center as compared to the same garden.
In general, the information provided by the above tests is very important for determining the complete surname of the solder joint structure and for understanding the performance of each step in the BGA assembly process implementation. Mastering the relationship between the information provided in the BGA assembly process and these physical tests can be used to prevent the occurrence of displacement phenomena, and to improve the related processes to eliminate the occurrence of defects. The x-ray layering method can reflect the defects that occur at any stage of the BGA assembly process.
Contact Detail:
Foreign Sale: Rainbow
Email:sales5@xdpcba.com
Skype:xingdapcbsales5
Tel:86-0755-29621535 Ext:817
| XD Electronic Technology Co.,LTD | ||||
| Seq | Item | capability | ||
| 1 | Base Material | FR-4, High TG FR-4 , Halogen Free material ,CEM-3,CEM-1,PTFE,Rogers ,Arlon ,Taconic,Aluminum base,Teflon,PI ,etc | ||
| 2 | Layers | 1-38 ( ≥30 layers needs review ) | ||
| 3 | Finished inner/outer copper thickness | 0.5-12OZ | ||
| 4 | Finished board thickness | 0.2-7.0mm(≤0.2mm needs review),≤0.4mm for HASL | ||
| Board thickness≤1.0mm: +/-0.1mm 1 Board thickness>2.0mm: +/-8% | ||||
| 5 | Max panel size | ≤2sidesPCB: 600*1500mm Multilayer PCB: 500*1200mm | ||
| 6 | Min conductor line width/spacing | Inner layers: ≥3/3mil Outer layers: ≥3.5/3.5mil | ||
| 7 | Min hole size | Mechanical hole: 0.15mm Laser hole: 0.1mm | ||
| Drilling precision: first drilling First drilling: 1mil Second drilling: 4mil | ||||
| 8 | Warpage | Board thickness≤0.79mm: β≤1.0% 0.80≤Board thickness≤2.4mm: β≤0.7% Board thickness≥2.5mm: β≤0.5% | ||
| 9 | Controlled Impedance | +/- 5 % Ω(<50Ω),+/-10%(≥50Ω),≥50Ω+/-5% (needs review) | ||
| 10 | Aspect Ratio | 15:01 | ||
| 11 | Min welding ring | 4mil | ||
| 12 | Min solder mask bridge | ≥0.08mm | ||
| 13 | Plugging vias capability | 0.2-0.8mm | ||
| 14 | Hole tolerance | PTH: +/-3mil NPTH: +/-2mil | ||
| 15 | Outline profile | Rout/ V-cut/ Bridge/ Stamp hole | ||
| 16 | Solder mask color | Green,yellow,black,blue,red,white,matte green | ||
| 17 | Component mark color | white,yellow,black | ||
| 18 | Surface treatment | OSP: 0.2-0.5um HASL: 2-40um Lead free HASL: 2-40um ENIG: Au 1-10U’’ ENEPIG: PB 2-5U’’/ Au 1-8U’’ Immersion Tin:0.8-1.5um Immersion silver: 0.1-1.2um Peelable blue mask Carbon ink Gold plating: Au 1-150U’’ | ||
| 19 | E-Test | Flying probe tester : 0.4-6.0mm,max 19.6*23.5inch | ||
| Min spacing from test pad to board edge : 0.5 mm | ||||
| Min conductive resistance : 5 Ω | ||||
| Max insulation resistance : 250 MΩ | ||||
| Max test voltage : 500 V | ||||
| Min test pad diameter : 6 mil | ||||
| Min test pad to pad spacing : 10 mil | ||||
| Max test current : 200 MA | ||||
| 20 | AOI | Orbotech SK-75 AOI : 0.05-6.0mm,max 23.5*23.5inch | ||
| Orbotech Ves machine : 0.05-6.0mm,max 23.5*23.5inch | ||||
Advantages of BGA PCBA
High density
The BGA is a solution to the problem of producing a miniature package for an integrated circuit with many hundreds of pins. Pin grid arrays and dual-in-line surface mount (SOIC) packages were being produced with more and more pins, and with decreasing spacing between the pins, but this was causing difficulties for the soldering process. As package pins got closer together, the danger of accidentally bridging adjacent pins with solder grew.
Heat conduction
A further advantage of BGA packages over packages with discrete leads (i.e. packages with legs) is the lower thermal resistance between the package and the PCB. This allows heat generated by the integrated circuit inside the package to flow more easily to the PCB, preventing the chip from overheating.
Low-inductance leads
The shorter an electrical conductor, the lower its unwanted inductance, a property which causes unwanted distortion of signals in high-speed electronic circuits. BGAs, with their very short distance between the package and the PCB, have low lead inductances, giving them superior electrical performance to pinned devices.
Test Method for BGA PCBA:
By X-ray layering, the following four basic physical test parameters can be obtained at the BGA solder joint:
1. location of the center of the solder joint
The relative position of the center of the solder joint in different image slices indicates the positioning of the component on the printed circuit board pad.
2. weld point radius
The weld spot radius measurement indicates the corresponding amount of solder in the solder joint on a particular level, and the radius measurement at the pad layer indicates
Any changes in the solder paste-printing process and due to pad contamination, at the ball level
Radius measurements indicate the problem of coplanarity of solder joints across components or printed circuit boards.
3. Take a number of loops around the solder joint and measure the thickness of the solder on each loop.
Ring thickness measurements and their various rates of change, showing the distribution of solder within the solder joints, using these parameters to discriminate
It is particularly effective when the situation is good or bad and the gap exists.
4. the error of the shape of the weld point relative to the ring (also known as roundness)
The roundness of the solder joints shows the symmetry of the solder distribution around the solder joints, which reflects alignment and wetting with the center as compared to the same garden.
In general, the information provided by the above tests is very important for determining the complete surname of the solder joint structure and for understanding the performance of each step in the BGA assembly process implementation. Mastering the relationship between the information provided in the BGA assembly process and these physical tests can be used to prevent the occurrence of displacement phenomena, and to improve the related processes to eliminate the occurrence of defects. The x-ray layering method can reflect the defects that occur at any stage of the BGA assembly process.
Contact Detail:
Foreign Sale: Rainbow
Email:sales5@xdpcba.com
Skype:xingdapcbsales5
Tel:86-0755-29621535 Ext:817
