Pcba Processing

XDPCBA8

More than 10 years experience in producing ATM machine PCBA, we can manufacture PCB, purchasing components and do SMT/DIP assembly. Our company has been recognized widely through good qualtity,quick delivery ,best service and reasonable price, such as automotive electronics, digital communications.

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Our strict quality control system for PCBA:

1. E-test for PCB.

2. IQC for components.

3. AOI test

4. PCBA function test

5. FQC

We have got UL, ROHS, ISO9001 certifications. We can provide PCBA for prototypes, small volume and mass production.

One-stop service for PCBA

PCB Manufacture Capability
Item	Specification
Material	FR-4, FR1,FR2; CEM-1, CEM-3,Rogers, Teflon,Arlon,Aluminum Base, Copper Base,Ceramic, Crockery, etc.
Remarks	High Tg CCL is Available(Tg>=170℃)
Finish Board Thickness	0.2 mm-6.00mm(8mil-126mil)
Surface Finish	Gold finger(>=0.13um), Immersion Gold(0.025-0075um), Plating Gold(0.025-3.0um), HASL(5-20um), OSP(0.2-0.5um)
Shape	Routing、Punch、V-cut、Chamfer
Surface Treatment	Solder Mask(black, green, white, red, blue, thickness>=12um, Block, BGA)
	Silkscreen(black, yellow, white)
	Peel able-mask(red, blue, thickness>=300um)
Minimum Core	0.075mm(3mil)
Copper Thickness	1/2 oz min; 12oz max
Min Trace Width & Line Spacing	0.075mm/0.075mm(3mil/3mil)
Min Hole Diameter for CNC Drilling	0.1mm(4mil)
Min Hole Diameter for Punching	0.6mm(35mil)
Biggest panel size	610mm * 508mm
Hole Position	+/-0.075mm(3mil) CNC Drilling
Conductor Width(W)	+/-0.05mm(2mil) or +/-20% of original
Hole Diameter(H)	PTHL:+/-0.075mm(3mil)
	Non PTHL:+/-0.05mm(2mil)
Outline Tolerance	+/-0.1mm(4mil) CNC Routing
Warp & Twist	0.70%
Insulation Resistance	10Kohm-20Mohm
Conductivity	<50ohm
Test Voltage	10-300V
Panel Size	110 x 100mm(min)
	660 x 600mm(max)
Layer-layer misregistration	4 layers:0.15mm(6mil)max
	6 layers:0.25mm(10mil)max
Min spacing between hole edge to circuitry pattern of an inner layer	0.25mm(10mil)
Min spacing between board outline to circuitry pattern of an inner layer	0.25mm(10mil)
Board thickness tolerance	4 layers:+/-0.13mm(5mil)

SMT Capacity
SMT Item	Capacity
PCB Max. size	510mm*1200mm(SMT)
Chip component	1206 0805 0603 0402 0201 package
Min.pin space of IC	0.1mm
Min. space of BGA	0.1mm
Max.precision of IC assembly	±0.01MM
Assembly capacity	≥8 million piots/day
DIP capacity	4 DIP production lines
Assembly testing	Bridge test,AOI test, X-Ray test, ICT(In Circuit Test),FCT (Functional Circuit Test)
FCT(Functional Circuit Test)	Current test, voltage test, high temperature and low temperature test, Drop Impact Test,aging test, water proof test,leakage-proof test and etc. Different test can be done according to your requirement.