Pcb Board Pcba

XDPCBA9

We are professional manufacturer of PCBA and products PCB assembly. We can provide one stop service, from manufacturing PCB, purchasing components to SMT/DIP assembly. With 10years experience in attendance machine filed, we can produce high quality PCBA. This kind of PCBA are sold mainly to Europe, the US, Russia and Australia.

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Our strict quality control system for PCBA:

1. E-test for PCB.

2. IQC for components.

3. AOI test

4. PCBA function test

5. FQC

We can provide PCBA for prototypes, small volume and mass production.

One-stop service for PCBA

PCB Manufacture Capability
Item	Specification
Material	FR-4, FR1,FR2; CEM-1, CEM-3,Rogers, Teflon,Arlon,Aluminum Base, Copper Base,Ceramic, Crockery, etc.
Remarks	High Tg CCL is Available(Tg>=170℃)
Finish Board Thickness	0.2 mm-6.00mm(8mil-126mil)
Surface Finish	Gold finger(>=0.13um), Immersion Gold(0.025-0075um), Plating Gold(0.025-3.0um), HASL(5-20um), OSP(0.2-0.5um)
Shape	Routing、Punch、V-cut、Chamfer
Surface Treatment	Solder Mask(black, green, white, red, blue, thickness>=12um, Block, BGA)
	Silkscreen(black, yellow, white)
	Peel able-mask(red, blue, thickness>=300um)
Minimum Core	0.075mm(3mil)
Copper Thickness	1/2 oz min; 12oz max
Min Trace Width & Line Spacing	0.075mm/0.075mm(3mil/3mil)
Min Hole Diameter for CNC Drilling	0.1mm(4mil)
Min Hole Diameter for Punching	0.6mm(35mil)
Biggest panel size	610mm * 508mm
Hole Position	+/-0.075mm(3mil) CNC Drilling
Conductor Width(W)	+/-0.05mm(2mil) or +/-20% of original
Hole Diameter(H)	PTHL:+/-0.075mm(3mil)
	Non PTHL:+/-0.05mm(2mil)
Outline Tolerance	+/-0.1mm(4mil) CNC Routing
Warp & Twist	0.70%
Insulation Resistance	10Kohm-20Mohm
Conductivity	<50ohm
Test Voltage	10-300V
Panel Size	110 x 100mm(min)
	660 x 600mm(max)
Layer-layer misregistration	4 layers:0.15mm(6mil)max
	6 layers:0.25mm(10mil)max
Min spacing between hole edge to circuitry pattern of an inner layer	0.25mm(10mil)
Min spacing between board outline to circuitry pattern of an inner layer	0.25mm(10mil)
Board thickness tolerance	4 layers:+/-0.13mm(5mil)

SMT Capacity
SMT Item	Capacity
PCB Max. size	510mm*1200mm(SMT)
Chip component	1206 0805 0603 0402 0201 package
Min.pin space of IC	0.1mm
Min. space of BGA	0.1mm
Max.precision of IC assembly	±0.01MM
Assembly capacity	≥8 million piots/day
DIP capacity	4 DIP production lines
Assembly testing	Bridge test,AOI test, X-Ray test, ICT(In Circuit Test),FCT (Functional Circuit Test)
FCT(Functional Circuit Test)	Current test, voltage test, high temperature and low temperature test, Drop Impact Test,aging test, water proof test,leakage-proof test and etc. Different test can be done according to your requirement.