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NRF52832-512kB

XDPCBA15
High quality, integrity and fast delivery time, that lead our company to be welcomed by the Europe ,We are rich experienced in air cleaner, which has over 10 years. We promise to use the new and original material and components. So the working life of the products are longer than other products. We continue to seek for the best quality and the fastest delivery time.
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       Assembly PCBA with NRF52832 SMD wireless RF transceiver IC QFN48 Chips NRF52832-QFAA NRF52832-QFAA-R

Our strict quality control system for PCBA:

1. E-test for PCB.

2. IQC for components.

3. AOI test

4. PCBA function test

5. FQC

One-stop service for PCBA

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  • PCB Manufacture Capability

  • MaterialNormal FR4,Normal Tg FR4(Halogen free)，High Tg FR4(Halogen free)，HDI PCB material
    PCB typeRigid pcb(Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance)
    BuildingsBlind&buried via type,HDI PCB
    Finish treatmentLead free,Leaded,aspect ratio,Max finished size,MIN finished size, PCB thickness, MAX high to gold finger
    Width/SpaceExternal Layer,Width tolerance
    Plating/coating thicknessTin thickness,OSP, ENIG, Immersion Silver,Immersion Tin,Hard gold, Soft gold
    HoleMAX thickness of mechanical hole 4mil/6mil/8mil,Min/Max laser drilling size,Finshed mechanical hole size
    Pad(ring)Min Pad size for laser drillings,Min Pad size for mechanical drillings,Min BGA pad size,Pad size tolerance(BGA)
    SoldermaskMAX drilling tool size for via filled with Soldermask (single side)
    Local mixed pressureMin gap between mechanical hole wall and conductor (Local mixed pressure area)
    Metal substrate PCB Layer counts,PCB size (Finished),MAX PCB size(Ceramic-substrate PCB),PCB thickness(Finished)
    RoutingMin space of the V-CUT does not reveal the copper ( Central Line of v-cut to internal/external circuits,H means board thickness)

  • SMT Capacity

    SMT Item

    Capacity

    PCB Max. size

    510mm*1200mm(SMT)

    Chip component

    1206 0805 0603 0402 0201 package

    Min.pin space of IC

    0.1mm

    Min. space of BGA

    0.1mm

    Max.precision of IC assembly

     ±0.01MM

    Assembly capacity

    ≥8 million piots/day

    DIP capacity

    4 DIP production lines

    Assembly testing

    Bridge test,AOI test, X-Ray test, ICT(In Circuit Test),FCT

    (Functional Circuit Test)


    FCT(Functional Circuit Test)

    Current test, voltage test, high temperature and low

    temperature test, Drop Impact Test,aging test,

    water proof test,leakage-proof test and etc.

    Different test can be done according to your requirement.

  • Packaging & Delivery

    • Packaging Details

    • Programmable package of Inner:
      vacuum packing or Anti-static package,Outer:export carton
      or according to the customer's requirement.

    • Port

    • shenzhen China

    • Picture Example:

    • package-img
      package-img

    • Lead Time:

    • Quantity(Pieces)1 - 10001001 - 10000>10000
      Est. Time(days)510To be negotiated

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