High Quality Microwave Oven PCBA Assembly And PCBA Mounting
Welcome to Xinda PCB/PCBA company
1.Specification of PCBA manufacturing
SMT Capacity
SMT Item Capacity
PCB Max. size 510mm*460mm(SMT)
Chip component 0805 0603 0402 0201 package
Min.pin space of IC 0.1mm
Min. space of BGA 0.1mm
Max.precision of IC assembly ±0.03mm
Assembly capacity ≥8 million piots/day
DIP capacity 6 DIP production lines
Assembly testing Bridge test,AOI test, X-Ray test, ICT(In Circuit Test),FCT(Functional Circuit Test)
FCT(Functional Circuit Test) Current test, voltage test, high temperature and low temperature test,Drop Impact Test,aging test,water proof test,leakage-proof test and etc.Different test can be done according to your requirement.
2.PCB/PCB Assembly files requests:
1.Gerber files of the bare PCB board
2.Bom for assembly, to short the lead time,please kindly advise us if there is any acceptable components substitution.
3.Testing Guide& Test Fixtures if necessary
4.Programming files& Programming tool if necessary
5.Schematic if necessary
3.customer visiting:
