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What Kind Of PCB Board Can We Make

author: Edit：Shenzhen Xin Da xing Electric Technology Co.,ltdUpDate：Nov 23, 2017
2022-01-14
Product categories:
FR4: Double-sided and multilayer board (up to 24 layers)
Thick copper plating board: the biggest thickness of the outer copper is 15oz,inner copper thickness is 12oz
Thick gold plating board: the biggest thickness of the gold is 150u’
Metal base printed board:Aluminum base printed board, Copper base printed board,Iron base printed board, FR4 or Metal mixing laminate，Rigid-Flexible PCB,up to 10 layers Rigid-Flexible PCB
High frequency board: Rogers series, isola series
Ceramic substrate PCB: Alumina ceramic PCB, Aluminum nitride ceramics PCB, Single-sides and double-sided ceramic PCB
Blind buried vias PCB: First order blind buried,2 order blind buried,3 order blind buried,10 layers of any interconnection blind buried
Other special circuit boards: aluminum foil FPC, large size circuit board.
Special technical :
The technical of nickel palladium gold, thick copper and thick gold
Resin plug hole technical
Silver pulp and copper pulp irrigation technical.
 
 Technical ability
 Project Parameter
 Layers 1-24 layers
Material FR4，TG150， TG170, TG180, High frequency material, Ceramic material, Metal base material,Rigid-Flexible material
Thickness 0.1-6.5mm
Maximum single size 600mm*1200mm
The thickness of copper the biggest thickness of the outer copper is 15oz,inner copper thickness is 12oz
 
Minimum hole diameter 0.1mm
Handling hole Blind hole,buried hole,half hole,resin plug hole,sunk head hole, silver paste irrigation hole,copper pulp irrigation hole
the maximum thickness of copper 40um
The depth ratio of hole diameter 10:1
Minimum line width and line spacing Sample 3/3Mil,mass production 3.5/3.5Mil
Line width tolerance ±20%
Minimum BGA ball 8MIL
The minimum spacing of BGA to line 6MIL
Minimum spacing between BGA and PAD 8MIL
Solder Mask dam 4MIL
The distance of inner hole to line 4 layers board 6mil,6/8 layers board 8MIL
warped degrees ≤0.75%
Impedance control +/-%10
The test process Rack test and flying needle test
Surface technical Tin spray with lead, Tin spray without lead,Sink tin, Sink silver, Sink gold,Sink nickel palladium gold,Electric flexible gold,Electric rigid gold, gold finger, antioxidant
Gold thickness 140u’
Thickness of spray tin 1-40um
Resistance welding color Green,White,Black, Yellow,Red
The order of blind buried holes First order blind buried,2 order blind buried,3 order blind buried 
One-time electrical test direct pass rate >99.5%(single-side board)，>98.5%( double-side board)，>97%(4 layers board)，>95%( 6 layers board)，>93.5%( 8 layers board)
Scrap rate 0.5%(single-side board），0.8%（double-side board），2%（4 layers board）,3%(6 layers board)，4-5%（8 layers board and above）
Others Multilayer metal base board, aluminum foil FPC
 
If there is more questions, please feel free to contact us.

Tel:+86-0755-23050569
mobile  phone:+86-15919476409
Skype: zenglixia666
Email: bluesky@xdpcba.com
Website:   www.xdpcba.com   
 
Xing Da Electric Technology Co.,Ltd
 

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