The PCB Industry Continues To Be Hot

The 6th Shenzhen International Circuit Board Procurement Exhibition (CS SHOW 2019) was held at the Shenzhen Convention and Exhibition Center last week. The exhibition was fully reflected based on new technology processes, new material solutions and new breakthroughs in the PCB industry in the 5G context. In the 5G era, large size, high multi-layer, high frequency, high speed, low loss, rigid, high and low frequency mixed pressure plates have become a new urgent need. So many process technologies will be used for PCB materials, process technology, equipment and quality control. Propose new and higher requirements.

Zheshang Securities said that the compound growth rate of China's PCB output value will be higher than the global PCB compound growth rate in the next five years, and the global PCB production capacity will gradually shift to China; by 2023, China's PCB production market share will reach 54.3%. As the market competition intensifies in the future, the concentration of the PCB industry will further increase, and it is expected that the future development of PCB companies will be like this.