Process Of PCB Multilayer Board Compression(2)

Process of PCB multilayer Board Compression(2)

2、Cap Lamination

It refers to the traditional lamination method of the early multilayer PCB board, then MLB's quote,out-layer's quote.After the production of MLB increased greatly in end of 1984, MSS lamination was not used until end of 1984, when the thin substrate with one side copper skin was superimposed and pressed. This early MLB compression method using single copper thin substrate was called Cap Lamination.At the same time, it was calledCap lamination.