PCB Giants Have Invested/increased in This High-end Sector

[PCB information network] recently, PCB and IC onboard board supplier Xin Xing electronics "as many customers as many. The company's ABF board capacity before 2025 production capacity is mostly booked "news exploded the industry, IC board also set off a wave of attention boom. 

The IC carrier provides support, heat dissipation, and protection for the chip, and provides an electronic connection to the PCB. IC carrier belongs to capital intensive industry, high technical requirements, expansion + climbing cycle is long, slow release of supply. The industry so described: high-end IC board PCB field on behalf of the highest technical level, known as the pearl on the crown.

According to the analysis of the organization, with the gradual release of domestic IDM and wafer foundries capacity, the domestic packaging and testing demand is driven. IC carrier plate is an important raw material for sealing and testing. It is expected that with the gradual release of domestic manufacturing and sealing and testing capacity, the domestic DEMAND for IC carrier plates will increase greatly. 

According to Primark, global packaging substrate production is estimated to be around $8.8 billion in 2022, with the most significant growth in packaging substrates for Flipboard products. The agency forecast that from 2020 to 2025, the annual compound growth rate of the output value of packaging substrate in China is about 12.9%, the growth rate is much higher than other regions, the global packaging substrate industry is moving towards the Chinese mainland, the domestic IC carrier substrate and manufacturers benefit from the domestic demand.

PCB giants have invested/increased

On the evening of August 2, Shennan Circuit (002916) disclosed the plan of the private placement, the company plans to raise funds of no more than 2.55 billion yuan, respectively into the high-end inversion chip IC carrier products manufacturing project and supplement the working capital. According to the plan, AvIC, the related party of Shennan Circuit, intends to subscribe for the add-issuance of 150 million yuan.

Shennan Circuit said that with the rapid increase in the requirements of electronic products miniaturization, as an important material for chip packaging, packaging substrate is widely used in smartphones and other fields, packaging substrate has entered a period of rapid development, market prospects are good; 

From the point of view of the project arrangement, the construction site of the project is located in Wuxi Shennan Industrial Park, the total investment of the project is 2.016 billion yuan, and the planned investment and raised fund is 1.8 billion yuan. The infrastructure construction period of the project is expected to be 2 years, and the production period is 2 years. It is estimated that the IRR of the project is 13.0% and the static payback period is 7.5 years. Shennan Circuit believes that the project has good economic benefits. 

In June this year, Shennan Circuit signed an investment agreement with the management Committee of Guangzhou Development Zone. Shennan Circuit intends to invest 200 million yuan to set up a wholly-owned subsidiary in Guangzhou Development Zone. With the Guangzhou subsidiary as the main body of the project implementation, the company will build the FC-BGA packaging substrate project with its own funds and self-raised funds, and the total investment is about 6 billion yuan. 

Coincidental, On July 29, Dongshan Precision announced that the company plans to invest to set up a wholly-owned subsidiary specializing in the RESEARCH and development, design, production, and sales of IC board, with a total investment of no more than 150,000 yuan. 

And a celebration held on July 18 JingWang electronics Zhuhai base project, also includes class loading board and IC package substrate factory, the design production capacity of 600000 m class loading board factory, products are mainly for Any layer - HDI, class loading board and loading board, at the highest level of 16, satisfy the intelligent terminal products of components "light, thin, short, small" requirements, with Higher wiring density, smaller and thinner dimensions, high-reliability features, dedicated to the small capacity space design of customer products

Kexiang shares on July 30 in the interactive platform for investors said that the company IC board project will enter small batch trial production in 2020, and is currently in the certification stage of some customers. On July 28,

Zhongjing Electronic said in the investor interactive platform, IC onboard special line is planning and configuration, at the same time in the sample test, and strive to form a mass production capacity this year. 

As the leading IC carrier leader in China, Xingsen technology has also attracted much attention. In terms of customer certification, Xingsen technology has passed Samsung certification and become an official supplier of Samsung. In terms of capacity expansion, the Production base in Guangzhou has a capacity of 20,000 square meters/month for IC packaging substrate.

Regarding the project of Guangzhou Xingke Semiconductor packaging industry, Xingson Technology said that the total investment of the project is 3 billion yuan, of which the first phase investment is 1.6 billion yuan, and the monthly production capacity is 30,000 square meters of IC packaging substrate and 15,000 square meters of the carrier plate, of which the company holds 41%, Guangzhou Science City Group holds 25%, and The Big fund holds 24%, the partnership (management team) holds 10% of the shares. At present, the roof of the plant has been capped, and the plant decoration and equipment installation, and debugging are planned to be completed in the second half of the year, and the pilot production stage will be entered at the end of this year. 

According to Xingsen technology, the future of IC packaging substrate is the strategic direction of the company's key development, and also the key investment field, and the application field is mainly in the direction of storage. 

The strength of Zhuhai Yue Ya semiconductor also cannot be underestimated. The company focuses on the research, development, and manufacturing of high-end organic non-core sealing loading plates. It is the first enterprise in the world to use the copper column method to produce non-core sealing loading plates and achieve mass production, breaking the monopoly of foreign high-end IC sealing loading plate manufacturers. 

On July 26, 2021, in the afternoon, the more successful semiconductor with Zhuhai Toyama industrial park management committee signed the three factories and semiconductor expansion of high-end rf and FCBGA loading board manufacturing project, the project is the more original factory load and the semiconductor Zhuhai nantong more after the semiconductor expansion, again the important planning investment in Zhuhai.

It is reported that after the project is completed, three factories will produce specialized Panels respectively, which can provide more than 120,000 Panels per month for the Via Post copper column loading method and more than 20,000 Panels per month for embedded sealing loading plate. FCBGA sealing load board monthly output of more than 60000 Panels, reinforcing China's semiconductor on the load board packaging materials of short and weak, keep the semiconductor in the radio frequency sealing loading plate on the market of the world's first, buried closure loading plate embedded industry first, FCBGA loading plate the advantage of the first, make contributions to China the strong rise of the semiconductor.

The industry still has room for improvement

With the development of 5G technology and the continuous practice of the concept of the Internet of Things, 5G and the Internet of Things are expected to lead the fourth global silicon content improvement cycle, continue to drive the growth of the semiconductor industry, and then drive the growth of the demand for upstream IC carrier materials, and the global IC carrier industry still has room to continue to improve. Especially the Chinese market, domestic IC board market demand is big, the future intelligent, high-tech products market demand will drive the demand of the packaging industry, with the rapid development of integrated circuit packaging companies, combined with the Chinese government strongly supportive of the whole electronic industry chain, is expected in the next few years domestic IC market will surge, load board, IC plate localization market space is very large.