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in The Next Two Years Gap As Higher As 50%. Expansion Has Stronger These PCB, IC Loading Board Maker, Have Also Been Layout
author: Edit：Shenzhen Xin Da xing Electric Technology Co.,ltd
2022-01-07
IC loading board has higher density, high precision, high performance, miniaturization, and the characteristics of the light. IC loading board is developed on the basis of the HDI board, is to adapt the technology innovation of the electronic packaging technology rapid development, has a high density, high precision, high performance, miniaturization and lightweight, etc. Substrate is advanced packaging used by a special key base material, between the IC chip and PCB have the effect of electric conduction, at the same time provide protection and support for the chip, heat dissipation, and form a standardized installation dimension. Packaging substrate can be mainly by encapsulating technology, material properties and application fields, such as ways to classify.
Since 2020, represented by the CPU, GPU, high-end chip products appear shortage of large area, one big reason is because of the FC - BGA board capacity shortage, and limit the FC - BGA plate load capacity factor is its core material ABF flavour essence dominated by Japan, far less than the market demand, production capacity shortage is expected to last until 2022.
Electronic times, according to Taiwan IC board table factory Xin xing electronics, circuit boards, South Asia kinsus technology is seeking land or increase capital spending, to support the new expansion plan. Semco Ibiden, at the same time, Japan Shinko, South Korea, LG innovation also increase ABF loading board production line is busy. Sources pointed out that the manufacturer is expected to further increase the capital investment in 2022.
And then mainly driven by two factors: supply and demand gap needs of capacity increment, and a new application of upgrading the technology needs.
First of all, from the perspective of supply and demand, over the past three months since the ABF loading board supply increasingly tight. Currently ABF loading board clients not only has a capacity contract next year, Xin xing electronic ABF loading board order visibility and even up to 2025 years.
At the same time, technical requirements are in progress. Goldman sachs believes that in 2022-2023, ABF loading board layer will be from the current mainstream 10 to 12-14 layer.
In 2020, according to Prismark data, global C plates of the size of the market for $10.2 billion, breakthrough 2011 peak, to maintain good growth momentum, the next compound growth rate of 9.7% in 2020-2025, the size of the market will reach $16.2 billion in 2025.
In this case, including a teacher electronics, Japan letterpress, Ibiden, AT&S, Shinko, xin xing, south electricity, kinsus, shennan circuit, the xing sen technology, zhuhai, ansett MAC d, global IC loading board manufacturers, open a new round of expansion, "ding technology, dongshan precision, JingWang electronic, zhong jing electronics, wins the macro into semiconductor science and technology, China Taiwan and the mainland, such as IC loading board PCB manufacturer also active investment fields.
In this case, including a teacher electronics, Japan letterpress, Ibiden, AT&S, Shinko, xin xing, south electricity, kinsus, shennan circuit, the xing sen technology, zhuhai, ansett MAC d, global IC loading board manufacturers, open a new round of expansion, "ding technology, dongshan precision, JingWang electronic, zhong jing electronics, wins the macro into semiconductor science and technology, China Taiwan and the mainland, such as IC loading board PCB manufacturer also active investment fields.
In contrast, domestic, including shennan circuit, the, the zhuhai xing sen into semiconductor science and technology, China, ansett are several domestic manufacturers such as layout of the ABF leads to FC - BGA board business, the more in the second half of 2021 but is now only zhuhai announced production FC - BGA board, China into semiconductor announced in March 2021 to achieve the FC - BGA board small batch Quantity production.
So far, only the shennan circuits and zhuhai and declaring expansion for ABF medium FC - BGA loading board, main overweight BT substrate from other manufacturers.
Since 2020, represented by the CPU, GPU, high-end chip products appear shortage of large area, one big reason is because of the FC - BGA board capacity shortage, and limit the FC - BGA plate load capacity factor is its core material ABF flavour essence dominated by Japan, far less than the market demand, production capacity shortage is expected to last until 2022.
Electronic times, according to Taiwan IC board table factory Xin xing electronics, circuit boards, South Asia kinsus technology is seeking land or increase capital spending, to support the new expansion plan. Semco Ibiden, at the same time, Japan Shinko, South Korea, LG innovation also increase ABF loading board production line is busy. Sources pointed out that the manufacturer is expected to further increase the capital investment in 2022.
And then mainly driven by two factors: supply and demand gap needs of capacity increment, and a new application of upgrading the technology needs.
First of all, from the perspective of supply and demand, over the past three months since the ABF loading board supply increasingly tight. Currently ABF loading board clients not only has a capacity contract next year, Xin xing electronic ABF loading board order visibility and even up to 2025 years.
At the same time, technical requirements are in progress. Goldman sachs believes that in 2022-2023, ABF loading board layer will be from the current mainstream 10 to 12-14 layer.
In 2020, according to Prismark data, global C plates of the size of the market for $10.2 billion, breakthrough 2011 peak, to maintain good growth momentum, the next compound growth rate of 9.7% in 2020-2025, the size of the market will reach $16.2 billion in 2025.
In this case, including a teacher electronics, Japan letterpress, Ibiden, AT&S, Shinko, xin xing, south electricity, kinsus, shennan circuit, the xing sen technology, zhuhai, ansett MAC d, global IC loading board manufacturers, open a new round of expansion, "ding technology, dongshan precision, JingWang electronic, zhong jing electronics, wins the macro into semiconductor science and technology, China Taiwan and the mainland, such as IC loading board PCB manufacturer also active investment fields.
In this case, including a teacher electronics, Japan letterpress, Ibiden, AT&S, Shinko, xin xing, south electricity, kinsus, shennan circuit, the xing sen technology, zhuhai, ansett MAC d, global IC loading board manufacturers, open a new round of expansion, "ding technology, dongshan precision, JingWang electronic, zhong jing electronics, wins the macro into semiconductor science and technology, China Taiwan and the mainland, such as IC loading board PCB manufacturer also active investment fields.
In contrast, domestic, including shennan circuit, the, the zhuhai xing sen into semiconductor science and technology, China, ansett are several domestic manufacturers such as layout of the ABF leads to FC - BGA board business, the more in the second half of 2021 but is now only zhuhai announced production FC - BGA board, China into semiconductor announced in March 2021 to achieve the FC - BGA board small batch Quantity production.
So far, only the shennan circuits and zhuhai and declaring expansion for ABF medium FC - BGA loading board, main overweight BT substrate from other manufacturers.
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