Development Trend Of LED Packaging

In recent years, many domestic and foreign scientific research institutions and enterprises have continued to conduct research on LED packaging technology. Excellent packaging materials and efficient packaging processes have been proposed successively. New high-reliability LED lighting products have appeared one after another, such as LED filament and flexible substrate packaging And also have certain performance requirements.

    With the continuous development of new materials, superconducting and superconducting materials have come out one after another, providing a solid foundation for the further development of LED packaging technology, such as graphene. , Chinese Academy of Sciences Semiconductors invented a flip-chip light-emitting diode with graphene as a thermally conductive layer. Using graphene's superior conductivity, part of the heat can be transferred to the substrate via the graphene thermally conductive layer, which increases the thermal conduction path of the device and improves The cooling effect [17].

    For the current LED chip using low-voltage DC drive, step-down rectification is required in the power driver, causing energy loss and reliability problems. It has been proposed to use high-voltage LED chips and AC LED chips for improvement. In September 2008, Taiwan's Industrial Research Institute won the US R & D100 Awards for its chip-based AC light-emitting diode lighting technology (OnChipAlternatingCurrentLEDLightingTechnology). ACLED (AlternatingCurrentLED) has low energy consumption, high efficiency, easy to use and other excellent performance, but also subverts the application of traditional LED.

    Three-dimensional packaging technology is a new concept for LED packaging. It puts forward more innovative requirements for design ideas and concepts, material characteristics, and packaging technology itself. From the emergence of 3D printing technology to today, there have been considerable improvements, making LED 3D packaging technology a possibility, but currently there are many difficulties to be overcome, such as composite preparation of materials, thermal stress balance control between materials, production efficiency, etc. Therefore, it can be said that the LED packaging technology based on three-dimensional printing technology is still a relatively distant idea.

    In the long run, LED packaging technology needs to expedite the exploration of packaging materials, packaging structures, and multifunctional systematic integration of three-dimensional packaging. According to the packaging concept of integrated circuits, the miniaturization of LED packages is improved, and keyless alloy wire packaging methods In order to realize the heat dissipation ability of high-efficiency light source module devices, solve the contradiction between light, heat and electricity in LED applications, and finally realize intelligent and systematic LED packaging technology to meet the increasingly complex LED application requirements.