[concerns] Japan 2021 Encapsulation Rights And Printed Circuit Industry Trends

 In package substrate, IBIDEN, shin kong motor and other leading companies are actively investment to increase production.

  With the enlargement of the base board market, the requirement of equipment, materials manufacturers are also growing. In order to meet the demand, parts enterprises in terms of increase of investment is also very impressive.

 Packaging substrate investment

 COVID - 19 outbreak had a great influence on the base board of Japanese industry, which IBIDEN and shin motor for high-end server of the demand of high-performance CPU packaging board, actively expand domestic investment in Japan.

 In response to the needs of high-end packaging substrate growth, IBIDEN since 2018 in Japan's main base through the central factory investment on a large scale (gifu prefecture). Issue of investment in the new line in October 2020, is expected to contribute to the second half of the 20 year performance. Electronic sector in fiscal 20 equipment investment will reach 80 billion yen. Xinguang motor investment in 2018-2021, 54 billion yen, the FC packaging substrate capacity increased by 40%.

  In addition to the above the two companies, and letterpress printing, kyocera, etc with FC packaging substrate production technology of Japanese companies, the future is likely the emergence of a new investment plan according to demand.

  Japan substrate/equipment industry in Japan, the domestic and foreign investment to increase production

  Japanese PCB material and equipment manufacturers are eager to invest in order to increase demand, especially for the increasing demand for high-performance packaging substrate materials, including 5 g for the next generation communication standard compatible with low transmission loss of the substrate material. IBIDEN Japan and Chinese Taiwan area of Unimicron large-scale high-end packaging board also increased investment project, is expected to medium and long term demand continues to grow. FCBGA, FCCSP high-performance packaging materials manufacturers have also announced plans to increase production.

  Japan panasonic will increase in the multilayer substrate material production capacity in China. Also factory will build a factory in guangzhou, and early next year to start mass production, related investment of 8 billion yen.

  The Japanese ink will also be a second home in South Korea for semiconductor packaging substrate production factory, to cope with advanced high-performance packaging substrate, the rapid expansion of the market. The company also in Hanoi, Vietnam to build new SRI factory, in mainland China, Taiwan, South Korea, the United States will also build new production base, basic USES the type of "local production for local consumption".