2019 International Electronic Circuit (Shenzhen) Exhibition International Technology Conference 2019.11.29

Present the latest market development trends and innovative technologies

Authoritative industry experts analyze industry hotspots to help you gain forward-looking knowledge

(Hong Kong, November 26, 2019) The 2019 International Electronic Circuits (Shenzhen) Exhibition co-organized by HKPCA (Hong Kong Circuit Board Association) and CPCA (China Electronic Circuit Industry Association) will be held from December 4 to 6, 2019 Held in Shenzhen. The exhibition scale covers Halls 1, 2, 4, 9 and parts of Shenzhen Convention and Exhibition Center. Before the show, it was called the "International Exhibition on Circuits and Electronic Assembly in South China". Although this year's show has been renamed, it has continued the 18 years of successful experience of the previous show, and its scale is the largest in history.

There will be seven exhibition areas on the exhibition site, including circuit board manufacturers, electronics assembly zones, environmental cleanliness zones, intelligent automation zones, equipment suppliers, raw material suppliers, and Japan and South Korea zones. Equipment and technology are the industry's end-of-year events that must not be missed. Zh

The 3-day international technical conference held concurrently with the exhibition covers the latest hot topics in the circuit board industry and provides valuable insights to the industry. The development of 5G technology has changed the entire industry, and the proliferation of connected devices will require newer and more complex circuit board technologies, for which reason the technology level of circuit board manufacturers has been continuously improved in various fields. Therefore, it is especially important for industry insiders to keep abreast of the latest industry development trends. The International Technology Conference will be held in Hall 4. It is an ideal business platform for visitors to understand the latest developments in the industry, inspire and learn to deal with the increasingly complex challenges facing the industry, and transform their business to a new level.

Gathered authoritative experts in the industry to talk about the current industry hot topics and share the latest industry trends:

The 2019 international technology conference has a strong lineup. Industry experts and representatives of well-known companies in the industry are invited to share with you the hottest topics in the industry and the latest developments in the circuit board market. The meeting will be kicked off by Mr. Zhong Taiqiang, Chairman of the Hong Kong Circuit Board Association. Later, Mr. Rai, the chairman of China Electronic Circuit Industry Association, will give another keynote speech.

Many industry heavyweight experts will share their insights at international technology conferences, including:

• Mr. Zhe Liu, Chief Engineer of ZTE Corporation, delivered a speech on “The Challenges and Opportunities Brought by 5G High Frequency to PCB and PCBA”. Mr. Liu is a well-known expert in the circuit board industry. He has published many books and papers on PCB manufacturing-related issues.

• N.T.Information Ltd. President Dr. Takao Nakahara delivered a speech on the theme of "The future development of the PCB industry". Dr. Hayao Nakahara is a respected consultant who advises circuit board manufacturing companies around the world.

• Managing Partner, Dr. Prismark Jiang Xugao will share the keynote speech on "PCB Market Trends and Prospects".

Prismark has established cooperation and service relationships with most advanced companies in the electronics, semiconductor, packaging, assembly, PCB, and materials fields.

• Mr. Lin Dinghao, Senior Project Director of the Technology R & D Center of Jingshuo Technology Co., Ltd., will bring a lecture entitled "Study on Structural Characteristics of Loading Plates". Mr. Lin has been a consultant to the Taiwan Circuit Board Association for 18 years, and has published more than 20 printed circuit board related books.

• Robert Shao, Project Manager of Robert Bosch Co., Ltd. will discuss "the opportunities and challenges brought by automotive electronics to circuit board materials and processing technology". Mr. Shao Tan Tan is responsible for the development of circuit board technology for automotive electronics at Robert Bosch.

Share the latest market trends, research and innovative products

In addition to the above-mentioned heavyweight guest speeches, there will be other industry leaders presenting various current market trends, research results and their innovative products. Wonderful topics include:

• VCP process status and development trend of VCP copper plating agent

• New antenna design

• 5G-driven communication board drilling solution

• Wirelaid-New generation thick copper circuit board technology, suitable for high current circuit boards and electric vehicle circuit boards

• Rogers Automotive Radar Sheet Processing and Reliability Introduction

5G–mmWave technology challenges to PCB manufacturing

• Eliminate total nitrogen, reuse nitric acid

• Future LDI technology development trends

• PCB / FPC special film application

• Next-generation DC multilayer plating solution "ELECTROPOSITTM1600"