The waterproof of PCB board

The low-pressure injection molding process is a packaging process that injects the package material into the mold at a very low injection pressure (1.5 to 40 bar) and rapidly solidifies (5 to 50 seconds) to achieve insulation, temperature resistance, impact resistance, and vibration reduction. , moisture, water, dust, chemical corrosion resistance, etc. This process provides high performance special hot melt adhesive as packaging material, mainly used for packaging and protection of precision and sensitive electronic components, including: printed circuit board (PCB) ), automotive electronics, cell phone batteries, wiring harnesses, waterproof connectors, sensors, microswitches, inductors, antennas, loops, etc.