Introduction to fpc circuit board materials

1, raw materials

(1) There is a rubber material, no glue material; the copper on the material is divided into electrolytic copper and rolled copper, and the material without glue rolling copper is flexible, and the folding property is better.

(2) Thickness of material: PI+ copper thickness

2, cover film

The cover film consists of PI and glue.

3, reinforcement

Reinforcement generally has the following types: PI reinforcement, PED reinforcement, FR4 reinforcement, steel sheet reinforcement, etc., general reinforcement thickness, PI1/2 1/2, PI11, PI21, PI31 to PI91, PI The two values represent the thickness of the PI and the thickness of the glue, respectively, in units of Mil. The thickness is based on customer requirements.

4, pure rubber

Pure glue is mainly used for lamination and layering of multi-layer boards, and also for bonding reinforcement.

5, screen closed film

It mainly acts as a signal screen and must be grounded.

6, three M glue

Bonding reinforcement and the role of fixing FPC circuit boards.