13.56MHze-ink screen phone case with independent NFC fpcb flex board antenna (enamel wire technology)OEM service
pcbgate251227164
1. Conductivity: Select enameled wire with good conductivity to ensure efficient signal transmission.
Diameter: Select an appropriate diameter enameled wire according to the antenna design requirements to meet the antenna's inductance and impedance characteristics.
2. Insulation Performance: Ensure good insulation performance of the enameled wire to prevent signal interference and short circuits.
3. Heat Resistance: In some applications, enameled wire may be affected by high temperatures; therefore, enameled wire with good heat resistance needs to be selected.
4. High Performance: NFC antennas offer the highest Q value and gain, making them more suitable for applications with high NFC performance requirements, such as devices requiring long-distance communication and stable operation in complex environments.
5. Lower Cost: Enameled wire is relatively inexpensive, and the manufacturing process is relatively simple, resulting in lower costs.
6. High Flexibility: Antennas of different shapes and sizes can be designed as needed to adapt to different application scenarios.
Diameter: Select an appropriate diameter enameled wire according to the antenna design requirements to meet the antenna's inductance and impedance characteristics.
2. Insulation Performance: Ensure good insulation performance of the enameled wire to prevent signal interference and short circuits.
3. Heat Resistance: In some applications, enameled wire may be affected by high temperatures; therefore, enameled wire with good heat resistance needs to be selected.
4. High Performance: NFC antennas offer the highest Q value and gain, making them more suitable for applications with high NFC performance requirements, such as devices requiring long-distance communication and stable operation in complex environments.
5. Lower Cost: Enameled wire is relatively inexpensive, and the manufacturing process is relatively simple, resulting in lower costs.
6. High Flexibility: Antennas of different shapes and sizes can be designed as needed to adapt to different application scenarios.
Quantity:
US $1.00
Unable to ship to shipping address, please feedback to us
13.56MHze-ink screen phone case with independent NFC fpcb flex board antenna (enamel wire technology)OEM service
Specifications:
I. Protocol Support: ISO/IEC-14443A
II. Operating Frequency: 13.56MHz
III. Antenna: Independent Antenna
IV. Scanning Distance: 0-1cm (related to transmitter power/antenna)
V. Antenna Pin Connection Method: Soldering
VI. Antenna Technology: Electromagnetic Coupling Induction
VII. Antenna Dimensions: 13*23*0.5mm
VIII. Antenna Material: Enameled Wire (Copper Wire)
IX. Operating Temperature: -20°C~+80°C
X. Storage Temperature: -40°C~+85°C
XI. Humidity: Relative Humidity 5%~95%
II. Operating Frequency: 13.56MHz
III. Antenna: Independent Antenna
IV. Scanning Distance: 0-1cm (related to transmitter power/antenna)
V. Antenna Pin Connection Method: Soldering
VI. Antenna Technology: Electromagnetic Coupling Induction
VII. Antenna Dimensions: 13*23*0.5mm
VIII. Antenna Material: Enameled Wire (Copper Wire)
IX. Operating Temperature: -20°C~+80°C
X. Storage Temperature: -40°C~+85°C
XI. Humidity: Relative Humidity 5%~95%
--Written by Liya-26.1.4
PCB product Capacity
| Value | Specification |
PCB Max. size | 510mm*1200mm(SMT) |
| Remarks | High Tg CCL is Available(Tg>=180℃) |
| Finish Board Thickness | 0.2 mm-6.00mm(8mil-126mil) |
| Surface Finish | Gold finger(>=0.13um), Immersion Gold(0.025-0075um), Plating Gold(0.025-3.0um), HASL(5-20um), OSP(0.2-0.5um) |
| Shape | Routing、Punch、V-cut、Chamfer |
| Surface Treatment | Solder Mask(black, green, white, red, blue, thickness>=12um, Block, BGA) |
| Silkscreen(black, yellow, white) | |
| Peel able-mask(red, blue, thickness>=300um) | |
| Minimum Core | 0.075mm(3mil) |
| Copper Thickness | 1/2 oz min; 12oz max |
| Min Trace Width & Line Spacing | 0.075mm/0.1mm(3mil/4mil) |
| Min Hole Diameter for CNC Drilling | 0.1mm(4mil) |
| Min Hole Diameter for Punching | 0.6mm(35mil) |
| Biggest panel size | 610mm * 508mm |
| Hole Position | +/-0.075mm(3mil) CNC Drilling |
| Conductor Width(W) | +/-0.05mm(2mil) or +/-20% of original |
| Hole Diameter(H) | PTHL:+/-0.075mm(3mil) |
| Non PTHL:+/-0.05mm(2mil) | |
| Outline Tolerance | +/-0.1mm(5mil) CNC Routing |
| Warp & Twist | 0.70% |
| Insulation Resistance | 10Kohm-20Mohm |
| Conductivity | <50ohm |
| Test Voltage | 10-300V |
| Panel Size | 110 x 100mm(min) |
| 660 x 600mm(max) | |
| Layer-layer misregistration | 4 layers:0.15mm(6mil)max |
| 6 layers:0.25mm(10mil)max | |
| Min spacing between hole edge to circuitry pattern of an inner layer | 0.25mm(10mil) |
| Min spacing between board outline to circuitry pattern of an inner layer | 0.25mm(10mil) |
| Board thickness tolerance | 4 layers:+/-0.13mm(5mil) |
Flexible PCB product Capacity
| Value | Capabilities |
| Items | FR-4, FR1,FR2; CEM-1, CEM-3,Rogers,Teflon,Arlon,Aluminum Base, Copper Base,Ceramic, Crockery, etc. |
| Layers | FPC：1 to 6 Layers,Rigid Flex：2 to 10 Layers |
| Base Copper Thickness | 1/3 oz to 2oz |
| Regular Base Material Thickness | 12.5um to 50um（FPC） |
| 0.1mm to 3.2mm（Rigid） | |
| Regular Coverlay Thickness | 27um to 50um |
| Regular Adhesive Thickness | 12um to 25um |
| Blind or Buried Vias | Yes |
| Impedance Control | Yes |
| Min.Line Width/Spacing | 0.04mm/0.04mm |
| Surface Finishing | Electroplate Ni/Au（Flash gold/Soft gold/Hard gold）,ENIG,Immersion Tin; plated silver;immersion silver ; OSP,HASL |
| Outline Fabrication | Die cut,laser cut,CNC routing,V-scoring |
| Hole to edge(Hard tool/Die Cut) | ±0.1/±0.2mm |
| Edge to edge(Hard tool/Die Cut) | ±0.05/±0.2mm |
| Circuit to edge(Hard tool/Die Cut) | ±0.07/±0.2mm |
PCB Assembly(SMT) Product Capacity
| Value | SMT Capacity |
| PCB Max. size | 510mm*1200mm(SMT) |
| Chip component | 01005,0201, 0402, 0603, 0805, 1206 package |
| Min.pin space of IC | 0.1mm |
| Min. space of BGA | 0.1mm |
| Max.precision of IC assembly | ±0.01mm |
| Surface Treatment | ≥8 million pionts/day |
| 6 DIP production lines | |
| Assembly testing | Current test, voltage test, high temperature and low temperature test. |
| Drop Impact Test,aging test,water proof test,leakage-proof test and etc. | |
| Different test can be done according to your requirement. |
Quality Control
Customers Visit our factory
Exhibition Show
Munich Exhibition&Moscow：
Russia Exhibition：
Q1:Are you a factory or trade company?
A: Xing Da Electronic Technology Co., ltd is leading OEM PCB&PCBA manufacturer in China with over 14 years rich experience. Our aim is “One-Stop service, smart manufacturing, make your production easier.”
Q2: What is needed for quotation?
A:1. PCB&FPC
We need Gerber files and specification for quotation
2. PCBA (= PCBA+ components + Assembly)
For PCBA, please send Gerber files, specification and Bom list for factory price.
A: Xing Da Electronic Technology Co., ltd is leading OEM PCB&PCBA manufacturer in China with over 14 years rich experience. Our aim is “One-Stop service, smart manufacturing, make your production easier.”
Q2: What is needed for quotation?
A:1. PCB&FPC
We need Gerber files and specification for quotation
2. PCBA (= PCBA+ components + Assembly)
For PCBA, please send Gerber files, specification and Bom list for factory price.
Q3:Is my PCB or PCBA files safe if I send it to you for manufacturing?
A: We respect customer's design authority and will never manufacture PCB or PCBA for someone else without your permission. We never share customer documents with third parties.NDA is acceptable.
Q4:What payment do you accept ?
A: T/T,Western Union,Paypal, L/C,Credit Card, Cheque,Others
A: We respect customer's design authority and will never manufacture PCB or PCBA for someone else without your permission. We never share customer documents with third parties.NDA is acceptable.
Q4:What payment do you accept ?
A: T/T,Western Union,Paypal, L/C,Credit Card, Cheque,Others
Q5: What's your shipping method?
A: 1. We have our own forwarders to ship goods with competitive price by DHL, UPS, FEDEX, TNT,EMS etc. We can also arrange shipments via sea or air depending on your specific requirements."
2. If you have your own forwarder, we can cooperate with them.
Q6: How about the MOQ?
A: There is no MOQ. We can produce prototypes, small orders, or large volumes.
A: 1. We have our own forwarders to ship goods with competitive price by DHL, UPS, FEDEX, TNT,EMS etc. We can also arrange shipments via sea or air depending on your specific requirements."
2. If you have your own forwarder, we can cooperate with them.
Q6: How about the MOQ?
A: There is no MOQ. We can produce prototypes, small orders, or large volumes.
