OEM service for high temperature and humidity resistant RFID flexible circuit modules for warehouse management
pcbgate251213150
Product Definition: RFID is a wireless communication technology, commonly used for automatic identification and object tracking. When the tag enters the magnetic field, it receives the radio frequency signal sent by the reader and transmits the product information stored in the chip by utilizing the energy obtained from the induced current. RFID is classified by application frequency into low frequency (LF), high frequency (HF), ultra-high frequency (UHF), and microwave (MW). The corresponding representative frequencies are: low frequency below 135KHz, high frequency 13.56MHz, ultra-high frequency 860M - 960MHz, and microwave 2.4G, 5.8G.
The RFID antenna flexible circuit board, as a form of RFID antenna, has effects that cannot be matched by products such as PCB hard boards and aluminum etching processes. Based on the spatial and functional requirements of the RFID antenna, we can provide ODM services for circuit board components using the flexible circuit board technology for our customers.
Product features highlights: The key feature of this product is its excellent antenna performance consistency. It maintains stable performance even under special conditions such as high temperature and high humidity. The assembly process is convenient, and the product is easy to assemble, meeting the requirements of most embedded devices.
Product application: Logistics, supply chain management, identification, library management, intelligent transportation, inventory checking, etc. Mainly realizes automatic authentication and tracking of objects.
The RFID antenna flexible circuit board, as a form of RFID antenna, has effects that cannot be matched by products such as PCB hard boards and aluminum etching processes. Based on the spatial and functional requirements of the RFID antenna, we can provide ODM services for circuit board components using the flexible circuit board technology for our customers.
Product features highlights: The key feature of this product is its excellent antenna performance consistency. It maintains stable performance even under special conditions such as high temperature and high humidity. The assembly process is convenient, and the product is easy to assemble, meeting the requirements of most embedded devices.
Product application: Logistics, supply chain management, identification, library management, intelligent transportation, inventory checking, etc. Mainly realizes automatic authentication and tracking of objects.
Quantity:
US $1.00
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OEM service for high temperature and humidity resistant RFID flexible circuit modules for warehouse management
Specifications:
Product hole: Minimum metallized hole diameter: None; Minimum non-metallized hole diameter: None
Product line: Minimum line width: 0.42 ± 0.02 mm Minimum line spacing: 0.27 ± 0.02 mm
Product solder mask & characters: 25um yellow overcoat film for solder mask, white characters
Finished product dimensions: 48.60 * 9.00 * 0.1mm (excluding PI reinforcement)
Surface treatment: Gold plating process, gold thickness 1-2 μm, nickel thickness 80-120 μm
Functional testing: Short-circuit test, RFID antenna performance test
Reliability test: Thermal shock test
Product-related certification tests: ROSH certification, darkroom testing, compatibility testing
Product line: Minimum line width: 0.42 ± 0.02 mm Minimum line spacing: 0.27 ± 0.02 mm
Product solder mask & characters: 25um yellow overcoat film for solder mask, white characters
Finished product dimensions: 48.60 * 9.00 * 0.1mm (excluding PI reinforcement)
Surface treatment: Gold plating process, gold thickness 1-2 μm, nickel thickness 80-120 μm
Functional testing: Short-circuit test, RFID antenna performance test
Reliability test: Thermal shock test
Product-related certification tests: ROSH certification, darkroom testing, compatibility testing
--Written by Liya-25.12.24
PCB product Capacity
| Value | Specification |
PCB Max. size | 510mm*1200mm(SMT) |
| Remarks | High Tg CCL is Available(Tg>=180℃) |
| Finish Board Thickness | 0.2 mm-6.00mm(8mil-126mil) |
| Surface Finish | Gold finger(>=0.13um), Immersion Gold(0.025-0075um), Plating Gold(0.025-3.0um), HASL(5-20um), OSP(0.2-0.5um) |
| Shape | Routing、Punch、V-cut、Chamfer |
| Surface Treatment | Solder Mask(black, green, white, red, blue, thickness>=12um, Block, BGA) |
| Silkscreen(black, yellow, white) | |
| Peel able-mask(red, blue, thickness>=300um) | |
| Minimum Core | 0.075mm(3mil) |
| Copper Thickness | 1/2 oz min; 12oz max |
| Min Trace Width & Line Spacing | 0.075mm/0.1mm(3mil/4mil) |
| Min Hole Diameter for CNC Drilling | 0.1mm(4mil) |
| Min Hole Diameter for Punching | 0.6mm(35mil) |
| Biggest panel size | 610mm * 508mm |
| Hole Position | +/-0.075mm(3mil) CNC Drilling |
| Conductor Width(W) | +/-0.05mm(2mil) or +/-20% of original |
| Hole Diameter(H) | PTHL:+/-0.075mm(3mil) |
| Non PTHL:+/-0.05mm(2mil) | |
| Outline Tolerance | +/-0.1mm(5mil) CNC Routing |
| Warp & Twist | 0.70% |
| Insulation Resistance | 10Kohm-20Mohm |
| Conductivity | <50ohm |
| Test Voltage | 10-300V |
| Panel Size | 110 x 100mm(min) |
| 660 x 600mm(max) | |
| Layer-layer misregistration | 4 layers:0.15mm(6mil)max |
| 6 layers:0.25mm(10mil)max | |
| Min spacing between hole edge to circuitry pattern of an inner layer | 0.25mm(10mil) |
| Min spacing between board outline to circuitry pattern of an inner layer | 0.25mm(10mil) |
| Board thickness tolerance | 4 layers:+/-0.13mm(5mil) |
Flexible PCB product Capacity
| Value | Capabilities |
| Items | FR-4, FR1,FR2; CEM-1, CEM-3,Rogers,Teflon,Arlon,Aluminum Base, Copper Base,Ceramic, Crockery, etc. |
| Layers | FPC：1 to 6 Layers,Rigid Flex：2 to 10 Layers |
| Base Copper Thickness | 1/3 oz to 2oz |
| Regular Base Material Thickness | 12.5um to 50um（FPC） |
| 0.1mm to 3.2mm（Rigid） | |
| Regular Coverlay Thickness | 27um to 50um |
| Regular Adhesive Thickness | 12um to 25um |
| Blind or Buried Vias | Yes |
| Impedance Control | Yes |
| Min.Line Width/Spacing | 0.04mm/0.04mm |
| Surface Finishing | Electroplate Ni/Au（Flash gold/Soft gold/Hard gold）,ENIG,Immersion Tin; plated silver;immersion silver ; OSP,HASL |
| Outline Fabrication | Die cut,laser cut,CNC routing,V-scoring |
| Hole to edge(Hard tool/Die Cut) | ±0.1/±0.2mm |
| Edge to edge(Hard tool/Die Cut) | ±0.05/±0.2mm |
| Circuit to edge(Hard tool/Die Cut) | ±0.07/±0.2mm |
PCB Assembly(SMT) Product Capacity
| Value | SMT Capacity |
| PCB Max. size | 510mm*1200mm(SMT) |
| Chip component | 01005,0201, 0402, 0603, 0805, 1206 package |
| Min.pin space of IC | 0.1mm |
| Min. space of BGA | 0.1mm |
| Max.precision of IC assembly | ±0.01mm |
| Surface Treatment | ≥8 million pionts/day |
| 6 DIP production lines | |
| Assembly testing | Current test, voltage test, high temperature and low temperature test. |
| Drop Impact Test,aging test,water proof test,leakage-proof test and etc. | |
| Different test can be done according to your requirement. |
Quality Control
Customers Visit our factory
Exhibition Show
Munich Exhibition&Moscow：
Russia Exhibition：
Q1:Are you a factory or trade company?
A: Xing Da Electronic Technology Co., ltd is leading OEM PCB&PCBA manufacturer in China with over 14 years rich experience. Our aim is “One-Stop service, smart manufacturing, make your production easier.”
Q2: What is needed for quotation?
A:1. PCB&FPC
We need Gerber files and specification for quotation
2. PCBA (= PCBA+ components + Assembly)
For PCBA, please send Gerber files, specification and Bom list for factory price.
A: Xing Da Electronic Technology Co., ltd is leading OEM PCB&PCBA manufacturer in China with over 14 years rich experience. Our aim is “One-Stop service, smart manufacturing, make your production easier.”
Q2: What is needed for quotation?
A:1. PCB&FPC
We need Gerber files and specification for quotation
2. PCBA (= PCBA+ components + Assembly)
For PCBA, please send Gerber files, specification and Bom list for factory price.
Q3:Is my PCB or PCBA files safe if I send it to you for manufacturing?
A: We respect customer's design authority and will never manufacture PCB or PCBA for someone else without your permission. We never share customer documents with third parties.NDA is acceptable.
Q4:What payment do you accept ?
A: T/T,Western Union,Paypal, L/C,Credit Card, Cheque,Others
A: We respect customer's design authority and will never manufacture PCB or PCBA for someone else without your permission. We never share customer documents with third parties.NDA is acceptable.
Q4:What payment do you accept ?
A: T/T,Western Union,Paypal, L/C,Credit Card, Cheque,Others
Q5: What's your shipping method?
A: 1. We have our own forwarders to ship goods with competitive price by DHL, UPS, FEDEX, TNT,EMS etc. We can also arrange shipments via sea or air depending on your specific requirements."
2. If you have your own forwarder, we can cooperate with them.
Q6: How about the MOQ?
A: There is no MOQ. We can produce prototypes, small orders, or large volumes.
A: 1. We have our own forwarders to ship goods with competitive price by DHL, UPS, FEDEX, TNT,EMS etc. We can also arrange shipments via sea or air depending on your specific requirements."
2. If you have your own forwarder, we can cooperate with them.
Q6: How about the MOQ?
A: There is no MOQ. We can produce prototypes, small orders, or large volumes.
