Multilayer pcb flexible printed circuit board Four-layer rigid flex pcb fabrication
pcbgate251129147
Four-layer rigid-flex PCB manufacturing process: The manufacturing process of a four-layer rigid-flex PCB involves multiple steps and processes. From material preparation to final packaging and warehousing, the entire process requires multiple quality control and inspection stages to ensure the final product meets requirements.
Specific steps include: material preparation, drilling, film application, exposure/development, line inspection, etching/film removal, etching inspection, IPQC, cleaning, applying inner layer cover film, lamination + baking, laser treatment, browning treatment, target punching, demolding + sandblasting, applying outer layer FR4 copper clad laminate, external PP sheet lamination, thermal shock testing, drilling, edge trimming, grinding, removing adhesive residue, immersion/copper plating, grinding, film application, exposure/development, line inspection, etching/film removal, etching inspection, IPQC, demolding, grinding/cleaning, double-sided printing of photosensitive green solder mask, pre-baking, exposure/development, baking, immersion gold plating, silkscreen printing, electrical testing, blind soldering, soldering outline -1, cap removal, final inspection, FQA, and packaging and warehousing.
Throughout the process, various techniques are employed, such as etching, film removal, and etching inspection, and multiple quality controls and tests are required to ensure that the product's quality and performance meet requirements.
Four-Layer Rigid-Flexible Circuit Board Applications
Four-layer rigid-flex boards, or multi-layer rigid-flex circuit boards, are electronic circuit boards with rigid-flex characteristics. They are currently widely used in industrial, mobile phone, consumer electronics, and automotive industries.
1. Industrial Applications: Includes industrial, military, and medical fields. Products in these fields have high requirements for rigid-flex circuit boards, requiring high reliability, high precision, low impedance loss,
Specific steps include: material preparation, drilling, film application, exposure/development, line inspection, etching/film removal, etching inspection, IPQC, cleaning, applying inner layer cover film, lamination + baking, laser treatment, browning treatment, target punching, demolding + sandblasting, applying outer layer FR4 copper clad laminate, external PP sheet lamination, thermal shock testing, drilling, edge trimming, grinding, removing adhesive residue, immersion/copper plating, grinding, film application, exposure/development, line inspection, etching/film removal, etching inspection, IPQC, demolding, grinding/cleaning, double-sided printing of photosensitive green solder mask, pre-baking, exposure/development, baking, immersion gold plating, silkscreen printing, electrical testing, blind soldering, soldering outline -1, cap removal, final inspection, FQA, and packaging and warehousing.
Throughout the process, various techniques are employed, such as etching, film removal, and etching inspection, and multiple quality controls and tests are required to ensure that the product's quality and performance meet requirements.
Four-Layer Rigid-Flexible Circuit Board Applications
Four-layer rigid-flex boards, or multi-layer rigid-flex circuit boards, are electronic circuit boards with rigid-flex characteristics. They are currently widely used in industrial, mobile phone, consumer electronics, and automotive industries.
1. Industrial Applications: Includes industrial, military, and medical fields. Products in these fields have high requirements for rigid-flex circuit boards, requiring high reliability, high precision, low impedance loss,
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Multilayer pcb flexible printed circuit board Four-layer rigid flex pcb fabrication
Specifications:
Four-layer rigid-flex PCB manufacturing process: The manufacturing process of a four-layer rigid-flex PCB involves multiple steps and processes. From material preparation to final packaging and warehousing, the entire process requires multiple quality control and inspection stages to ensure the final product meets requirements.
Specific steps include: material preparation, drilling, film application, exposure/development, line inspection, etching/film removal, etching inspection, IPQC, cleaning, applying inner layer cover film, lamination + baking, laser treatment, browning treatment, target punching, demolding + sandblasting, applying outer layer FR4 copper clad laminate, external PP sheet lamination, thermal shock testing, drilling, edge trimming, grinding, removing adhesive residue, immersion/copper plating, grinding, film application, exposure/development, line inspection, etching/film removal, etching inspection, IPQC, demolding, grinding/cleaning, double-sided printing of photosensitive green solder mask, pre-baking, exposure/development, baking, immersion gold plating, silkscreen printing, electrical testing, blind soldering, soldering outline -1, cap removal, final inspection, FQA, and packaging and warehousing.
Throughout the process, various techniques are employed, such as etching, film removal, and etching inspection, and multiple quality controls and tests are required to ensure that the product's quality and performance meet requirements.
--Written by Lisa-25.12.5
PCB product Capacity
| Value | Specification |
PCB Max. size | 510mm*1200mm(SMT) |
| Remarks | High Tg CCL is Available(Tg>=180℃) |
| Finish Board Thickness | 0.2 mm-6.00mm(8mil-126mil) |
| Surface Finish | Gold finger(>=0.13um), Immersion Gold(0.025-0075um), Plating Gold(0.025-3.0um), HASL(5-20um), OSP(0.2-0.5um) |
| Shape | Routing、Punch、V-cut、Chamfer |
| Surface Treatment | Solder Mask(black, green, white, red, blue, thickness>=12um, Block, BGA) |
| Silkscreen(black, yellow, white) | |
| Peel able-mask(red, blue, thickness>=300um) | |
| Minimum Core | 0.075mm(3mil) |
| Copper Thickness | 1/2 oz min; 12oz max |
| Min Trace Width & Line Spacing | 0.075mm/0.1mm(3mil/4mil) |
| Min Hole Diameter for CNC Drilling | 0.1mm(4mil) |
| Min Hole Diameter for Punching | 0.6mm(35mil) |
| Biggest panel size | 610mm * 508mm |
| Hole Position | +/-0.075mm(3mil) CNC Drilling |
| Conductor Width(W) | +/-0.05mm(2mil) or +/-20% of original |
| Hole Diameter(H) | PTHL:+/-0.075mm(3mil) |
| Non PTHL:+/-0.05mm(2mil) | |
| Outline Tolerance | +/-0.1mm(5mil) CNC Routing |
| Warp & Twist | 0.70% |
| Insulation Resistance | 10Kohm-20Mohm |
| Conductivity | <50ohm |
| Test Voltage | 10-300V |
| Panel Size | 110 x 100mm(min) |
| 660 x 600mm(max) | |
| Layer-layer misregistration | 4 layers:0.15mm(6mil)max |
| 6 layers:0.25mm(10mil)max | |
| Min spacing between hole edge to circuitry pattern of an inner layer | 0.25mm(10mil) |
| Min spacing between board outline to circuitry pattern of an inner layer | 0.25mm(10mil) |
| Board thickness tolerance | 4 layers:+/-0.13mm(5mil) |
Flexible PCB product Capacity
| Value | Capabilities |
| Items | FR-4, FR1,FR2; CEM-1, CEM-3,Rogers,Teflon,Arlon,Aluminum Base, Copper Base,Ceramic, Crockery, etc. |
| Layers | FPC：1 to 6 Layers,Rigid Flex：2 to 10 Layers |
| Base Copper Thickness | 1/3 oz to 2oz |
| Regular Base Material Thickness | 12.5um to 50um（FPC） |
| 0.1mm to 3.2mm（Rigid） | |
| Regular Coverlay Thickness | 27um to 50um |
| Regular Adhesive Thickness | 12um to 25um |
| Blind or Buried Vias | Yes |
| Impedance Control | Yes |
| Min.Line Width/Spacing | 0.04mm/0.04mm |
| Surface Finishing | Electroplate Ni/Au（Flash gold/Soft gold/Hard gold）,ENIG,Immersion Tin; plated silver;immersion silver ; OSP,HASL |
| Outline Fabrication | Die cut,laser cut,CNC routing,V-scoring |
| Hole to edge(Hard tool/Die Cut) | ±0.1/±0.2mm |
| Edge to edge(Hard tool/Die Cut) | ±0.05/±0.2mm |
| Circuit to edge(Hard tool/Die Cut) | ±0.07/±0.2mm |
PCB Assembly(SMT) Product Capacity
| Value | SMT Capacity |
| PCB Max. size | 510mm*1200mm(SMT) |
| Chip component | 01005,0201, 0402, 0603, 0805, 1206 package |
| Min.pin space of IC | 0.1mm |
| Min. space of BGA | 0.1mm |
| Max.precision of IC assembly | ±0.01mm |
| Surface Treatment | ≥8 million pionts/day |
| 6 DIP production lines | |
| Assembly testing | Current test, voltage test, high temperature and low temperature test. |
| Drop Impact Test,aging test,water proof test,leakage-proof test and etc. | |
| Different test can be done according to your requirement. |
Quality Control
Customers Visit our factory
Exhibition Show
Munich Exhibition&Moscow：
Russia Exhibition：
Q1:Are you a factory or trade company?
A: Xing Da Electronic Technology Co., ltd is leading OEM PCB&PCBA manufacturer in China with over 14 years rich experience. Our aim is “One-Stop service, smart manufacturing, make your production easier.”
Q2: What is needed for quotation?
A:1. PCB&FPC
We need Gerber files and specification for quotation
2. PCBA (= PCBA+ components + Assembly)
For PCBA, please send Gerber files, specification and Bom list for factory price.
A: Xing Da Electronic Technology Co., ltd is leading OEM PCB&PCBA manufacturer in China with over 14 years rich experience. Our aim is “One-Stop service, smart manufacturing, make your production easier.”
Q2: What is needed for quotation?
A:1. PCB&FPC
We need Gerber files and specification for quotation
2. PCBA (= PCBA+ components + Assembly)
For PCBA, please send Gerber files, specification and Bom list for factory price.
Q3:Is my PCB or PCBA files safe if I send it to you for manufacturing?
A: We respect customer's design authority and will never manufacture PCB or PCBA for someone else without your permission. We never share customer documents with third parties.NDA is acceptable.
Q4:What payment do you accept ?
A: T/T,Western Union,Paypal, L/C,Credit Card, Cheque,Others
A: We respect customer's design authority and will never manufacture PCB or PCBA for someone else without your permission. We never share customer documents with third parties.NDA is acceptable.
Q4:What payment do you accept ?
A: T/T,Western Union,Paypal, L/C,Credit Card, Cheque,Others
Q5: What's your shipping method?
A: 1. We have our own forwarders to ship goods with competitive price by DHL, UPS, FEDEX, TNT,EMS etc. We can also arrange shipments via sea or air depending on your specific requirements."
2. If you have your own forwarder, we can cooperate with them.
Q6: How about the MOQ?
A: There is no MOQ. We can produce prototypes, small orders, or large volumes.
A: 1. We have our own forwarders to ship goods with competitive price by DHL, UPS, FEDEX, TNT,EMS etc. We can also arrange shipments via sea or air depending on your specific requirements."
2. If you have your own forwarder, we can cooperate with them.
Q6: How about the MOQ?
A: There is no MOQ. We can produce prototypes, small orders, or large volumes.
