Camera lens focus flex pcb fpc line module flexible pcb materials pcb prototype board
pcbgate250224134
Product Definition:
A camera lens focus flexible circuit board is a flexible circuit board used for camera lens focus. It offers high precision, high stability, and ease of use. This flexible circuit board typically consists of a multilayer circuit board, its surface covered with electronic components and chips. It receives, processes, and analyzes video data from the camera. It can implement functions such as autofocus and manual focus to meet diverse user needs.
The primary function of a camera lens focus flexible circuit board is to control the camera's focus system. When focusing the camera lens, the flexible circuit board determines whether the focus is correct based on the image sensor data. If adjustment is required, it sends a signal to the lens's drive motor, which then adjusts the lens position until the correct focus is achieved. This process can be automated or manually controlled.
A camera lens focus flexible circuit board is a flexible circuit board used for camera lens focus. It offers high precision, high stability, and ease of use. This flexible circuit board typically consists of a multilayer circuit board, its surface covered with electronic components and chips. It receives, processes, and analyzes video data from the camera. It can implement functions such as autofocus and manual focus to meet diverse user needs.
The primary function of a camera lens focus flexible circuit board is to control the camera's focus system. When focusing the camera lens, the flexible circuit board determines whether the focus is correct based on the image sensor data. If adjustment is required, it sends a signal to the lens's drive motor, which then adjusts the lens position until the correct focus is achieved. This process can be automated or manually controlled.
Quantity:
US $1.00
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Camera lens focus flex pcb fpc line module flexible pcb materials pcb prototype board
Specification
Product Holes:
Minimum Plated Hole Diameter: 0.2 ± 0.075mm;
Minimum Non-Plated Hole Diameter: 0.8 ± 0.05mm
Minimum Plated Hole Diameter: 0.2 ± 0.075mm;
Minimum Non-Plated Hole Diameter: 0.8 ± 0.05mm
Product Solder Mask & Characters:
IC Finger Window: 12.5 x 3mm
Etched Character Line Width/Height: 0.13 x 1.28mm
IC Finger Window: 12.5 x 3mm
Etched Character Line Width/Height: 0.13 x 1.28mm
Finished Product Dimensions: 87.3 x 72.69mm
Surface Finish: Immersion Gold
Functional Testing: Open and Short Circuit Testing
Reliability Testing: Thermal Shock Testing, Tinning Testing, and Reinforced Peel Strength Testing
Reliability Testing: Thermal Shock Testing, Tinning Testing, and Reinforced Peel Strength Testing
Product Highlights:
High Precision: The flexible printed circuit board's wiring accuracy is extremely high, reaching micron levels, ensuring accurate focusing of camera lenses.
High Stability: The flexible printed circuit board's materials and manufacturing process are extremely stable, ensuring long-term stability and reliability.
High Usability: The flexible printed circuit board can easily connect to various camera lenses and sensors and can be controlled and debugged via software, making it extremely easy to use.
Applications: Various cameras, camcorders, mobile phones, and other fields
--Written by Miya-251017
PCB product Capacity
| Value | Specification |
PCB Max. size | 510mm*1200mm(SMT) |
| Remarks | High Tg CCL is Available(Tg>=180℃) |
| Finish Board Thickness | 0.2 mm-6.00mm(8mil-126mil) |
| Surface Finish | Gold finger(>=0.13um), Immersion Gold(0.025-0075um), Plating Gold(0.025-3.0um), HASL(5-20um), OSP(0.2-0.5um) |
| Shape | Routing、Punch、V-cut、Chamfer |
| Surface Treatment | Solder Mask(black, green, white, red, blue, thickness>=12um, Block, BGA) |
| Silkscreen(black, yellow, white) | |
| Peel able-mask(red, blue, thickness>=300um) | |
| Minimum Core | 0.075mm(3mil) |
| Copper Thickness | 1/2 oz min; 12oz max |
| Min Trace Width & Line Spacing | 0.075mm/0.1mm(3mil/4mil) |
| Min Hole Diameter for CNC Drilling | 0.1mm(4mil) |
| Min Hole Diameter for Punching | 0.6mm(35mil) |
| Biggest panel size | 610mm * 508mm |
| Hole Position | +/-0.075mm(3mil) CNC Drilling |
| Conductor Width(W) | +/-0.05mm(2mil) or +/-20% of original |
| Hole Diameter(H) | PTHL:+/-0.075mm(3mil) |
| Non PTHL:+/-0.05mm(2mil) | |
| Outline Tolerance | +/-0.1mm(5mil) CNC Routing |
| Warp & Twist | 0.70% |
| Insulation Resistance | 10Kohm-20Mohm |
| Conductivity | <50ohm |
| Test Voltage | 10-300V |
| Panel Size | 110 x 100mm(min) |
| 660 x 600mm(max) | |
| Layer-layer misregistration | 4 layers:0.15mm(6mil)max |
| 6 layers:0.25mm(10mil)max | |
| Min spacing between hole edge to circuitry pattern of an inner layer | 0.25mm(10mil) |
| Min spacing between board outline to circuitry pattern of an inner layer | 0.25mm(10mil) |
| Board thickness tolerance | 4 layers:+/-0.13mm(5mil) |
Flexible PCB product Capacity
| Value | Capabilities |
| Items | FR-4, FR1,FR2; CEM-1, CEM-3,Rogers,Teflon,Arlon,Aluminum Base, Copper Base,Ceramic, Crockery, etc. |
| Layers | FPC：1 to 6 Layers,Rigid Flex：2 to 10 Layers |
| Base Copper Thickness | 1/3 oz to 2oz |
| Regular Base Material Thickness | 12.5um to 50um（FPC） |
| 0.1mm to 3.2mm（Rigid） | |
| Regular Coverlay Thickness | 27um to 50um |
| Regular Adhesive Thickness | 12um to 25um |
| Blind or Buried Vias | Yes |
| Impedance Control | Yes |
| Min.Line Width/Spacing | 0.04mm/0.04mm |
| Surface Finishing | Electroplate Ni/Au（Flash gold/Soft gold/Hard gold）,ENIG,Immersion Tin; plated silver;immersion silver ; OSP,HASL |
| Outline Fabrication | Die cut,laser cut,CNC routing,V-scoring |
| Hole to edge(Hard tool/Die Cut) | ±0.1/±0.2mm |
| Edge to edge(Hard tool/Die Cut) | ±0.05/±0.2mm |
| Circuit to edge(Hard tool/Die Cut) | ±0.07/±0.2mm |
PCB Assembly(SMT) Product Capacity
| Value | SMT Capacity |
| PCB Max. size | 510mm*1200mm(SMT) |
| Chip component | 01005,0201, 0402, 0603, 0805, 1206 package |
| Min.pin space of IC | 0.1mm |
| Min. space of BGA | 0.1mm |
| Max.precision of IC assembly | ±0.01mm |
| Surface Treatment | ≥8 million pionts/day |
| 6 DIP production lines | |
| Assembly testing | Current test, voltage test, high temperature and low temperature test. |
| Drop Impact Test,aging test,water proof test,leakage-proof test and etc. | |
| Different test can be done according to your requirement. |
Quality Control
Customers Visit our factory
Exhibition Show
Munich Exhibition&Moscow：
Russia Exhibition：
Q1:Are you a factory or trade company?
A: Xing Da Electronic Technology Co., ltd is leading OEM PCB&PCBA manufacturer in China with over 14 years rich experience. Our aim is “One-Stop service, smart manufacturing, make your production easier.”
Q2: What is needed for quotation?
A:1. PCB&FPC
We need Gerber files and specification for quotation
2. PCBA (= PCBA+ components + Assembly)
For PCBA, please send Gerber files, specification and Bom list for factory price.
A: Xing Da Electronic Technology Co., ltd is leading OEM PCB&PCBA manufacturer in China with over 14 years rich experience. Our aim is “One-Stop service, smart manufacturing, make your production easier.”
Q2: What is needed for quotation?
A:1. PCB&FPC
We need Gerber files and specification for quotation
2. PCBA (= PCBA+ components + Assembly)
For PCBA, please send Gerber files, specification and Bom list for factory price.
Q3:Is my PCB or PCBA files safe if I send it to you for manufacturing?
A: We respect customer's design authority and will never manufacture PCB or PCBA for someone else without your permission. We never share customer documents with third parties.NDA is acceptable.
Q4:What payment do you accept ?
A: T/T,Western Union,Paypal, L/C,Credit Card, Cheque,Others
A: We respect customer's design authority and will never manufacture PCB or PCBA for someone else without your permission. We never share customer documents with third parties.NDA is acceptable.
Q4:What payment do you accept ?
A: T/T,Western Union,Paypal, L/C,Credit Card, Cheque,Others
Q5: What's your shipping method?
A: 1. We have our own forwarders to ship goods with competitive price by DHL, UPS, FEDEX, TNT,EMS etc. We can also arrange shipments via sea or air depending on your specific requirements."
2. If you have your own forwarder, we can cooperate with them.
Q6: How about the MOQ?
A: There is no MOQ. We can produce prototypes, small orders, or large volumes.
A: 1. We have our own forwarders to ship goods with competitive price by DHL, UPS, FEDEX, TNT,EMS etc. We can also arrange shipments via sea or air depending on your specific requirements."
2. If you have your own forwarder, we can cooperate with them.
Q6: How about the MOQ?
A: There is no MOQ. We can produce prototypes, small orders, or large volumes.
