PCBA WiFi&BLE Module Electronic Components for Smart Control XDW025-A0-MWB
WiFi+BLE Module XDW025-A0-MWB Electronic Components for Smart buildings Medical Devices
Welcome to XingDa Electric Technology Co.,Ltd
Xindaxing Electric Technology Co.,ltd
- Model Number:XDW025-A0-MWB-BLE
- Type:Module
- Place of Origin:Guangdong, China
- Brand Name:Original
- D/C:22+
- Package:Surface Mount
- Brand:XDW025-A0-MWB
- RAM Size:276KB
- Size / Dimension:20.3mm*15.8mm*2.3mm
- Operating Temperature:-20℃~+85℃
- Voltage - Supply (Vcc/Vdd):-0.3V-3.9V
- Part Number:XDW025-A0-MWB
- MOQ:1
- Quality guarantee:original
- Condition:New and Original
- Part Status:in stock
Product Description:
This module is a cost-effective WIFI+BLE module that supports BLE dual-mode 5.1 and IEEE 802.11 b/g/nProtocol standard, supports lightweight TCP/IP protocol stack, and supports STA, AP and Direct modes. users canuse this mod to add networking capabilities to existing equipment, or to build stand-alone network controllers.
1.1. Product Features
Main frequency: 120MHz
Built-in low-power 32-bit MCU, can be used as application processor
RAMBuilt-in 256KB RAM
Working voltage: 3.3V
Peripherals: 6xPWM, 2xUART, 1xSPI, 2x I2C, 18xGPIO, 5xADC
WIFI main features:
Support 802.11 b/g/n standard protocol
Support WIFI + dual-mode BLE 5.1
Built-in lightweight TCP/IP protocol stack
Built-in TR switch, Balun, LNA, PA, and integrated on-board antenna
Support remote firmware OTA upgrade, support to start the upgrade through AT command
Support STA, AP and Direct mode
1.2. Main application areas
Smart buildings
Smart Home/Appliances
Medical Devices
Industrial wireless control
Intelligent bus
2. Specifications
Dimensions:
The module adopts stamp hole + gold finger design, the overall size of PCBA is 20.3mm*15.8mm*2.3mm.
Our Services:
We are a professional PCBA manufacturer, and provide customers with a complete set of OEM and EMS services.
PCB Assembly (SMT) Product Capacity:
SMT Capacity | ||
SMT Item | Capacity | |
PCB Max. size | 510mm*1200mm(SMT) | |
Chip component | 0201, 0402, 0603, 0805, 1206 package | |
Min.pin space of IC | 0.1mm | |
Min. space of BGA | 0.1mm | |
Max.precision of IC assembly | ±0.01mm | |
Assembly capacity | ≥8 million piots/day | |
DIP capacity | 6 DIP production lines | |
Assembly testing | Bridge test,AOI test, X-Ray test, ICT(In Circuit Test),FCT(Functional Circuit Test) | |
| Current test, voltage test, high temperature and low temperature test,Drop Impact Test,aging test,water proof test,leakage-proof test and etc.Different test can be done according to your requirement. | |
| Available | |
Product Application
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FAQ
Q1:Are you a factory or trade company?
A: XingDa is a professional OEM&ODM manufacturer.
Q2:What payment do you accept?
A: TT/ Western Union/ Paypal/ Unistream.
Q3: What's your shipping way?
A: 1. We have our own forwarder to ship goods by DHL, UPS, FEDEX, TNT,EMS.
2. If you have your own forwarder, we can cooperate with them.
Q4: How about the MOQ?
A: No
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