PCBA manufacturing pcba with DIP components soldering circuit boards

XDPCBA-002

Dip soldering is a manufacturing process where a technician dips objects into a bath of molten solder to fix parts together. The most common application of this technique is in the production of circuit boards, where it can be a fast and efficient method. The heat of the solder can potentially damage parts of the project, and the technician has to make sure all the components can take the heat before dipping; usually the project is all metal to avoid this problem.

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PCBA manufacturing pcba with DIP components soldering circuit boards

What is Dip Soldering?
Dip soldering is a manufacturing process where a technician dips objects into a bath of molten solder to fix parts together. The most common application of this technique is in the production of circuit boards, where it can be a fast and efficient method. The heat of the solder can potentially damage parts of the project, and the technician has to make sure all the components can take the heat before dipping; usually the project is all metal to avoid this problem.

With circuit board production, the solder will stick to the exposed mental components and will not adhere to areas without metal or areas treated with a chemical to resist solder. Dip soldering may be a hand operation, with a technician personally dipping the product, and it is also possible to partially automate it. A machine can grip the circuit board, dip it at the right angle, and keep it in the solder for the correct period of time before pulling it out.

The dip soldering process is similar to wave soldering, a mass production process people use to make chips. With wave soldering, it is all automated, and the chips pass under a steady flow of melted solder material, rather than being dipped. This process costs more money to implement and allows people to produce more projects per day, making it suitable for large scale facilities where people need to cut down on manufacturing time.

For small-scale soldering, dip soldering can be a useful technique. People do not need very much equipment to set it up, simply a container large enough to dip projects, with appropriate tools for melting the solder so it will be usable. Many companies manufacture the necessary supplies, and people can also make their own. For automated setups, slightly larger investments are needed to purchase a machine capable of handling the process.

People may learn this and other techniques on the job or while in a training program to prepare for a professional career. There are a number of types of solder available, and the technician has to be able to choose the correct mixture and make other decisions during the process to make sure the final product will perform properly. People usually inspect the project after dip soldering to see if any manual adjustments are necessary, such as cleaning excess solder off a contact or discarding an item with damage like pockmarks or distortions from the soldering process.

PCBA-099 PCBA3

Overview

Xinda provides PCBA assembly, low to medium MASS production volume. Our professional SMT factory has advanced equipment, such as the world-class stencil printing, SMT chip pick & place, solder reflow, and in-line testing and steel mesh manufacturing. AOI test machine and X-ray testing machines for quality check.

Xinda PCB Assembly

Xinda offers turn-key PCB assembly services OEM in prototype quantities or low-volume to mid-volume production runs. We handle the whole process including: ordering all the components, PCB manufacturing, PCB assembly, testing and final shipment. We are capable of assembling BGA, Micro-BGA, QFN and other leadless package parts.

SMT and Through-Hole Assembly	Fine Pitch Component Insertion
Lead free Assembly	BGA and QFN Assembly
One-stop PCB Assembly	BGA X-Ray Inspection
Prototype PCB Assembly	Automated Optical Inspection
PCB Assembly in low volumes	PCB testing for functionality
AOI Testing Checks for solder paste Checks for components down to 0201" Checks for missing components, offset, incorrect parts, polarity X-Ray Inspection X-Ray provides high-resolution inspection	In-Circuit Testing In-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by component problems. Power-up Test Advanced Function Test Flash Device Programming Functional testing
Selective Wave Soldering	Conformal Coating
Complete box build	Kitting and 3D printing

Surface Mount Technology
Xinda all products follow IPC2 standards.With 18 years experience of placing BGA, UBGA, CSP and small profile passives down to and including 0201, Xinda offers a cost effective high yield solution to any SMT requirement.

Pin Through Hole
Capabilities to place tape and reeled radial components sizes. Maximum PCB size is 40"x 40". Placement rates reach 15000 pieces per hour with an accuracy of 99% minimizing component loss.

RoHS Regulations
Xinda have 2 kinds of solutions. Leadfree and leaded soldering process. Each solutions room are divided into 2 seperated places. so there is no mix up.

Selective Wave Solder
Having the Selective Wave soldering machines, Xinda achieves consistent quality and process control when assembling boards having multiple ground and power planes, high-current connectors or A-typical distribution of components. All AOI tested before QC.IPQC.

Conformal coating
Both dip-coating and vertical spray coating is available. Protecting non conductive dielectric layer that is applied onto the printed circuit board assembly to protect the electronic assembly from damage due to contamination, salt spray, moisture, fungus, dust and corrosion caused by harsh or extreme environments. When coated, it is clearly visible as a clear and shiny material.