Polyimide OSP Single layer flex pcb car light flex circuit board

FPC-pcbgate-0001

Medical controller FPC. remote control FPC. FPC control board FPC. impedance control FPC. lcd controller FPC. Flex Circuit FPC Flex PCB.controlled rigid-flex pcb. controlled rigid flex prototype flexible pcb.

Country of Origin

Shenzhen

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US $0.50 / piece

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Model Number:fr4 rogers double sided pcb;fr4 0.8 mm antenna pcb
Place of Origin:Guangdong, China
Brand Name:Xing Da
Number of Layers:8-layer
Base Material:FR-4,FR2.Taconic,Rogers, CEM-1 CEM-3,ceramic,crock
Copper Thickness:1/2 oz min; 12 oz max
Board Thickness:0.2mm-6mm(8mil-126mil)
Min. Hole Size:0.25mm
Min. Line Width:0.075mm(3mil)
Min. Line Spacing:0.075mm
Surface Finishing:HASL / HASL lead free, Chemical tin, Chemical Gold
Hole Positon:+/-0.075mm(3mil) CNC Driling
Insulation Resistance:10Kohm-20Mohm
Conductivity:<50ohm
Different Impendance:+/-10%
Outline Tolerance:0.125mm(5mil) CNC Routing;+/-0.15mm(6mil) by Punching
Warp & Twist:0.70%
Hole Diameter(H):PTH L:+/-0.075mm(3mil);Non-PTH L:+/-0.05mm(2mil)
Biggest panel size:610mm*508mm
Board thickness tolerance:4 layers:+/-0.13mm(5mil);6 layers:+/-0.15mm(6mil) .

Polyimide OSP Single layer flex pcb car light flex circuit board

PCB/PCBsAssemblyOEMFactory in Shenzhen

Welcome to XingDa Electric Technology Co.,Ltd

Xindaxing Electric Technology Co.,LTd

Our Services

We can provide one-stop service:

1. PCB circuit boards+Assembly

2. E-test.

3.Electronic components purchasing.

4. PCB assembly: available on SMT, BGA, DIP.

5. PCBA functiontest.

6. Enclosure assembly.

Flexible PCB product Capacity

FPC Tech Specification
Items	Capabilities
Layers	FPC:1 to 6 Layers, Rigid Flex: 2 to 10 Layers
Regular Base Materials	Kapton,Polyimide(PI), Polyester(PET),
Base Copper Thickness	1/3 oz to 8oz
Regular Base Material Thickness	12.5um to 50um(FPC)
Regular Base Material Thickness	0.1mm to 3.2mm(Rigid)
Regular Coverlay Thickness	27um to 50um
Regular Adhesive Thickness	12um to 25um
Blind or Buried Vias	Yes
Impedance Control	Yes
Min.Line Width/Spacing	0.04mm/0.04mm
Surface Finishing	Electroplate Ni/Au(Flash gold/Soft gold/Hard gold), ENIG, HASL, Immersion Tin,OSP
Outline Fabrication	Die cut, laser cut, CNC routing, V-scoring
Hole to edge(Hard tool/Die Cut)	±0.1/±0.2mm
Edge to edge(Hard tool/Die Cut)	±0.05/±0.2mm
Circuit to edge(Hard tool/Die Cut)	±0.07/±0.2mm

PCB Assembly(SMT) Product Capacity

SMT Capacity
SMT Item	Capacity
PCB Max. size	510mm*1200mm(SMT)
Chip component	0201,0402,0603,0805, 1206package
Min.pin space of IC	0.1mm
Min. space of BGA	0.1mm
Max.precision of IC assembly	±0.01mm
Assembly capacity	≥8 million piots/day
DIP capacity	6 DIP production lines
Assembly testing	Bridge test,AOI test, X-Ray test, ICT(In Circuit Test),FCT(Functional Circuit Test)
FCT(Functional Circuit Test)	Current test, voltage test, high temperature and low temperature test,Drop Impact Test,aging test,water proof test,leakage-proof test and etc.Different test can be done according to your requirement.