Manufacturing of flexible circuit boards for high-frequency (13.56MHz) signal transmission in mobile payment and identity recognition.
pcbgate251213153
Product Definition: The wireless frequency is the radio signal frequency on which the RFID system operates. Depending on the different frequencies of radio operation, the working frequency can be classified into four types: low frequency, high frequency, ultra-high frequency, and microwave. The main frequencies include 125K-135K, 13.56 MHz, and 2.45 GHz. The first two belong to the electromagnetic induction method, while the third belongs to the microwave reflection method. The 13.56 MHz band belongs to the high frequency. The circuit part of high frequency requires lower signal loss. For flexible circuit boards, a smaller Dk/Df is required. Materials capable of transmitting high-frequency (13.56 MHz) signals have certain requirements for the substrate and solder mask of flexible circuit boards.
Based on the specific structure and functional requirements of 13.56mhz products, we can provide customers with ODM services for flexible circuit board components of 13.56mhz products.
Product features and highlights: Flexible circuit board capable of transmitting high-frequency (13.56MHZ) signals. The material has stable performance and resonant capacitor design.
Product applications: Smart helmets, identity recognition, mobile payment, etc.
Based on the specific structure and functional requirements of 13.56mhz products, we can provide customers with ODM services for flexible circuit board components of 13.56mhz products.
Product features and highlights: Flexible circuit board capable of transmitting high-frequency (13.56MHZ) signals. The material has stable performance and resonant capacitor design.
Product applications: Smart helmets, identity recognition, mobile payment, etc.
Quantity:
US $1.00
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Manufacturing of flexible circuit boards for high-frequency (13.56MHz) signal transmission in mobile payment and identity recognition.
Specifications:
Product Holes:
Minimum Metalized Hole: 0.20 ± 0.075 mm Minimum Non-metalized Hole: 1.50 ± 0.075 mm
Product Specifications:
Minimum Line Width: 0.35 ± 0.02 mm
Minimum Line Spacing: 0.15 ± 0.02 mm
Product Anti-oxidation & Characters: 25 um coverage film for anti-oxidation, 10 um white silk-screen characters
Finished product dimensions: 20mm diameter round shape, thickness: 0.35mm (including steel sheet)
Surface treatment: Gold plating process, gold thickness ≥ 2u", nickel thickness 100 - 160u"
Function testing: Open circuit test, antenna resonant frequency test, antenna internal resistance test
Reliability testing: Thermal shock test
Product-related certification tests: ROHS certification
Minimum Metalized Hole: 0.20 ± 0.075 mm Minimum Non-metalized Hole: 1.50 ± 0.075 mm
Product Specifications:
Minimum Line Width: 0.35 ± 0.02 mm
Minimum Line Spacing: 0.15 ± 0.02 mm
Product Anti-oxidation & Characters: 25 um coverage film for anti-oxidation, 10 um white silk-screen characters
Finished product dimensions: 20mm diameter round shape, thickness: 0.35mm (including steel sheet)
Surface treatment: Gold plating process, gold thickness ≥ 2u", nickel thickness 100 - 160u"
Function testing: Open circuit test, antenna resonant frequency test, antenna internal resistance test
Reliability testing: Thermal shock test
Product-related certification tests: ROHS certification
--Written by Liya-25.12.27
PCB product Capacity
| Value | Specification |
PCB Max. size | 510mm*1200mm(SMT) |
| Remarks | High Tg CCL is Available(Tg>=180℃) |
| Finish Board Thickness | 0.2 mm-6.00mm(8mil-126mil) |
| Surface Finish | Gold finger(>=0.13um), Immersion Gold(0.025-0075um), Plating Gold(0.025-3.0um), HASL(5-20um), OSP(0.2-0.5um) |
| Shape | Routing、Punch、V-cut、Chamfer |
| Surface Treatment | Solder Mask(black, green, white, red, blue, thickness>=12um, Block, BGA) |
| Silkscreen(black, yellow, white) | |
| Peel able-mask(red, blue, thickness>=300um) | |
| Minimum Core | 0.075mm(3mil) |
| Copper Thickness | 1/2 oz min; 12oz max |
| Min Trace Width & Line Spacing | 0.075mm/0.1mm(3mil/4mil) |
| Min Hole Diameter for CNC Drilling | 0.1mm(4mil) |
| Min Hole Diameter for Punching | 0.6mm(35mil) |
| Biggest panel size | 610mm * 508mm |
| Hole Position | +/-0.075mm(3mil) CNC Drilling |
| Conductor Width(W) | +/-0.05mm(2mil) or +/-20% of original |
| Hole Diameter(H) | PTHL:+/-0.075mm(3mil) |
| Non PTHL:+/-0.05mm(2mil) | |
| Outline Tolerance | +/-0.1mm(5mil) CNC Routing |
| Warp & Twist | 0.70% |
| Insulation Resistance | 10Kohm-20Mohm |
| Conductivity | <50ohm |
| Test Voltage | 10-300V |
| Panel Size | 110 x 100mm(min) |
| 660 x 600mm(max) | |
| Layer-layer misregistration | 4 layers:0.15mm(6mil)max |
| 6 layers:0.25mm(10mil)max | |
| Min spacing between hole edge to circuitry pattern of an inner layer | 0.25mm(10mil) |
| Min spacing between board outline to circuitry pattern of an inner layer | 0.25mm(10mil) |
| Board thickness tolerance | 4 layers:+/-0.13mm(5mil) |
Flexible PCB product Capacity
| Value | Capabilities |
| Items | FR-4, FR1,FR2; CEM-1, CEM-3,Rogers,Teflon,Arlon,Aluminum Base, Copper Base,Ceramic, Crockery, etc. |
| Layers | FPC：1 to 6 Layers,Rigid Flex：2 to 10 Layers |
| Base Copper Thickness | 1/3 oz to 2oz |
| Regular Base Material Thickness | 12.5um to 50um（FPC） |
| 0.1mm to 3.2mm（Rigid） | |
| Regular Coverlay Thickness | 27um to 50um |
| Regular Adhesive Thickness | 12um to 25um |
| Blind or Buried Vias | Yes |
| Impedance Control | Yes |
| Min.Line Width/Spacing | 0.04mm/0.04mm |
| Surface Finishing | Electroplate Ni/Au（Flash gold/Soft gold/Hard gold）,ENIG,Immersion Tin; plated silver;immersion silver ; OSP,HASL |
| Outline Fabrication | Die cut,laser cut,CNC routing,V-scoring |
| Hole to edge(Hard tool/Die Cut) | ±0.1/±0.2mm |
| Edge to edge(Hard tool/Die Cut) | ±0.05/±0.2mm |
| Circuit to edge(Hard tool/Die Cut) | ±0.07/±0.2mm |
PCB Assembly(SMT) Product Capacity
| Value | SMT Capacity |
| PCB Max. size | 510mm*1200mm(SMT) |
| Chip component | 01005,0201, 0402, 0603, 0805, 1206 package |
| Min.pin space of IC | 0.1mm |
| Min. space of BGA | 0.1mm |
| Max.precision of IC assembly | ±0.01mm |
| Surface Treatment | ≥8 million pionts/day |
| 6 DIP production lines | |
| Assembly testing | Current test, voltage test, high temperature and low temperature test. |
| Drop Impact Test,aging test,water proof test,leakage-proof test and etc. | |
| Different test can be done according to your requirement. |
Quality Control
Customers Visit our factory
Exhibition Show
Munich Exhibition&Moscow：
Russia Exhibition：
Q1:Are you a factory or trade company?
A: Xing Da Electronic Technology Co., ltd is leading OEM PCB&PCBA manufacturer in China with over 14 years rich experience. Our aim is “One-Stop service, smart manufacturing, make your production easier.”
Q2: What is needed for quotation?
A:1. PCB&FPC
We need Gerber files and specification for quotation
2. PCBA (= PCBA+ components + Assembly)
For PCBA, please send Gerber files, specification and Bom list for factory price.
A: Xing Da Electronic Technology Co., ltd is leading OEM PCB&PCBA manufacturer in China with over 14 years rich experience. Our aim is “One-Stop service, smart manufacturing, make your production easier.”
Q2: What is needed for quotation?
A:1. PCB&FPC
We need Gerber files and specification for quotation
2. PCBA (= PCBA+ components + Assembly)
For PCBA, please send Gerber files, specification and Bom list for factory price.
Q3:Is my PCB or PCBA files safe if I send it to you for manufacturing?
A: We respect customer's design authority and will never manufacture PCB or PCBA for someone else without your permission. We never share customer documents with third parties.NDA is acceptable.
Q4:What payment do you accept ?
A: T/T,Western Union,Paypal, L/C,Credit Card, Cheque,Others
A: We respect customer's design authority and will never manufacture PCB or PCBA for someone else without your permission. We never share customer documents with third parties.NDA is acceptable.
Q4:What payment do you accept ?
A: T/T,Western Union,Paypal, L/C,Credit Card, Cheque,Others
Q5: What's your shipping method?
A: 1. We have our own forwarders to ship goods with competitive price by DHL, UPS, FEDEX, TNT,EMS etc. We can also arrange shipments via sea or air depending on your specific requirements."
2. If you have your own forwarder, we can cooperate with them.
Q6: How about the MOQ?
A: There is no MOQ. We can produce prototypes, small orders, or large volumes.
A: 1. We have our own forwarders to ship goods with competitive price by DHL, UPS, FEDEX, TNT,EMS etc. We can also arrange shipments via sea or air depending on your specific requirements."
2. If you have your own forwarder, we can cooperate with them.
Q6: How about the MOQ?
A: There is no MOQ. We can produce prototypes, small orders, or large volumes.
