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PCBA for monitors

Flexible printed circuit smart glow stick four-layer rigid flexible pcb flex circuit board

pcbgate251122144
Product Definition: The fluorescent stick is packaged on the surface of the product structure with polyethylene (plastic) and has a glass tube layer inside. The liquids inside the layer are peroxides and ester compounds. By bending, hitting, and rubbing, the glass breaks, causing a reaction between the two compounds and resulting in the fluorescent dye emitting light.
The intelligent fluorescent stick uses the circuit board manufacturing process as the base substrate for the electronic product scheme, with colorful LED chips as the light source, and an MCU as the controller. The toggle structure components and capacitive touch keys serve as the light display mode switch. Combined with Bluetooth and NFC technologies, it adds IoT control function applications to the intelligent fluorescent stick.
The flexible intelligent fluorescent stick substrate is mainly based on soft board and soft-hard combined board processes. The four-layer soft-hard combined circuit board process can effectively place more functional circuits into the space of the intelligent fluorescent stick. According to the specific space and functional requirements of the smart ring, we provide ODM services for circuit board components based on the soft-hard combined process for customers.

Product Feature Highlights: The four-layer soft-hard combined board is made of ultra-thin materials, and the LED light board needs to be designed and produced using white film or white oil processes.

Product Application: Intelligent fluorescent sticks for various application scenarios such as entertainment concerts, night fishing, weddings, outdoor activities, military operations, construction projects, and underwater operations.
Quantity:
1.00
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Flexible printed circuit smart glow stick four-layer rigid flexible pcb flex circuit board


Specifications:

Product holes: Minimum metallized hole diameter: 0.30mm ± 0.075mm; Minimum non-metallized hole diameter: 0.75mm ± 0.075mm
Product circuits: Minimum circuit width: 0.15mm ± 0.02mm; Minimum circuit spacing: 0.10mm ± 0.02mm
Product solder mask & characters: Customizable
Finished product dimensions: 215*18.10*0.45mm Surface treatment: Gold plating 1-2 layers
Functional test: Open circuit test Reliability test: Thermal shock test

--Written by Lisa-25.11.20

PCB product Capacity
 
ValueSpecification

PCB Max. size

510mm*1200mm(SMT)

RemarksHigh Tg CCL is Available(Tg>=180℃)
Finish Board Thickness0.2 mm-6.00mm(8mil-126mil)
Surface FinishGold finger(>=0.13um), Immersion Gold(0.025-0075um), Plating Gold(0.025-3.0um), HASL(5-20um), OSP(0.2-0.5um)
ShapeRouting、Punch、V-cut、Chamfer
Surface TreatmentSolder Mask(black, green, white, red, blue, thickness>=12um, Block, BGA)
Silkscreen(black, yellow, white)
Peel able-mask(red, blue, thickness>=300um)
Minimum Core0.075mm(3mil)
Copper Thickness1/2 oz min; 12oz max
Min Trace Width & Line Spacing0.075mm/0.1mm(3mil/4mil)
Min Hole Diameter for CNC Drilling0.1mm(4mil)
Min Hole Diameter for Punching0.6mm(35mil)
Biggest panel size610mm * 508mm
Hole Position+/-0.075mm(3mil) CNC Drilling
Conductor Width(W)+/-0.05mm(2mil) or +/-20% of original
Hole Diameter(H)PTHL:+/-0.075mm(3mil)
Non PTHL:+/-0.05mm(2mil)
Outline Tolerance+/-0.1mm(5mil) CNC Routing
Warp & Twist0.70%
Insulation Resistance10Kohm-20Mohm
Conductivity<50ohm
Test Voltage10-300V
Panel Size110 x 100mm(min)
660 x 600mm(max)
Layer-layer misregistration4 layers:0.15mm(6mil)max
6 layers:0.25mm(10mil)max
Min spacing between hole edge to circuitry pattern of an inner layer0.25mm(10mil)
Min spacing between board outline to circuitry pattern of an inner layer0.25mm(10mil)
Board thickness tolerance4 layers:+/-0.13mm(5mil)
 

Flexible PCB product Capacity

Value    Capabilities
ItemsFR-4, FR1,FR2; CEM-1, CEM-3,Rogers,Teflon,Arlon,Aluminum Base, Copper Base,Ceramic, Crockery, etc.
LayersFPC:1 to 6 Layers,Rigid Flex:2 to 10 Layers
Base Copper Thickness1/3 oz to 2oz
Regular Base Material Thickness                                                            12.5um to 50um(FPC)
 0.1mm to 3.2mm(Rigid)
Regular Coverlay Thickness27um to 50um
Regular Adhesive Thickness12um to 25um
Blind or Buried ViasYes
Impedance ControlYes
Min.Line Width/Spacing0.04mm/0.04mm
Surface FinishingElectroplate Ni/Au(Flash gold/Soft gold/Hard gold),ENIG,Immersion Tin; plated silver;immersion silver ; OSP,HASL
Outline FabricationDie cut,laser cut,CNC routing,V-scoring
Hole to edge(Hard tool/Die Cut)±0.1/±0.2mm
Edge to edge(Hard tool/Die Cut)±0.05/±0.2mm
Circuit to edge(Hard tool/Die Cut)±0.07/±0.2mm
 
 

PCB Assembly(SMT) Product Capacity

Value                                                                         SMT Capacity
PCB Max. size510mm*1200mm(SMT)
Chip component01005,0201, 0402, 0603, 0805, 1206 package
Min.pin space of IC0.1mm
Min. space of BGA0.1mm
Max.precision of IC assembly±0.01mm
Surface Treatment≥8 million pionts/day
6 DIP production lines
Assembly testingCurrent test, voltage test, high temperature and low temperature test.
Drop Impact Test,aging test,water proof test,leakage-proof test and etc.                                             
Different test can be done according to your requirement.
 

Quality Control
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Q1:Are you a factory or trade company?
A: Xing Da Electronic Technology Co., ltd is leading OEM PCB&PCBA manufacturer in China with over 14 years rich experience. Our aim is “One-Stop service, smart manufacturing, make your production easier.”
 
Q2: What is needed for quotation?
A:1. PCB&FPC
    We need Gerber files and specification for quotation
2. PCBA (= PCBA+ components + Assembly)
    For PCBA, please send Gerber files, specification and Bom list for factory price.
 
Q3:Is my PCB or PCBA files safe if I send it to you for manufacturing?
A: We respect customer's design authority and will never manufacture PCB or PCBA for someone else without your permission. We never share customer documents with third parties.NDA is acceptable.
  
Q4:What payment do you accept ?
A: T/T,Western Union,Paypal, L/C,Credit Card, Cheque,Others
 
Q5: What's your shipping method?
A: 1. We have our own forwarders to ship goods with competitive price by DHL, UPS, FEDEX, TNT,EMS etc. We can also arrange shipments via sea or air depending on your specific requirements."
   2. If you have your own forwarder, we can cooperate with them.
 
Q6: How about the MOQ?
A: There is no MOQ. We can produce prototypes, small orders, or large volumes.