Flexible printed circuit smart glow stick four-layer rigid flexible pcb flex circuit board
pcbgate251122144
Product Definition: The fluorescent stick is packaged on the surface of the product structure with polyethylene (plastic) and has a glass tube layer inside. The liquids inside the layer are peroxides and ester compounds. By bending, hitting, and rubbing, the glass breaks, causing a reaction between the two compounds and resulting in the fluorescent dye emitting light.
The intelligent fluorescent stick uses the circuit board manufacturing process as the base substrate for the electronic product scheme, with colorful LED chips as the light source, and an MCU as the controller. The toggle structure components and capacitive touch keys serve as the light display mode switch. Combined with Bluetooth and NFC technologies, it adds IoT control function applications to the intelligent fluorescent stick.
The flexible intelligent fluorescent stick substrate is mainly based on soft board and soft-hard combined board processes. The four-layer soft-hard combined circuit board process can effectively place more functional circuits into the space of the intelligent fluorescent stick. According to the specific space and functional requirements of the smart ring, we provide ODM services for circuit board components based on the soft-hard combined process for customers.
Product Feature Highlights: The four-layer soft-hard combined board is made of ultra-thin materials, and the LED light board needs to be designed and produced using white film or white oil processes.
Product Application: Intelligent fluorescent sticks for various application scenarios such as entertainment concerts, night fishing, weddings, outdoor activities, military operations, construction projects, and underwater operations.
The intelligent fluorescent stick uses the circuit board manufacturing process as the base substrate for the electronic product scheme, with colorful LED chips as the light source, and an MCU as the controller. The toggle structure components and capacitive touch keys serve as the light display mode switch. Combined with Bluetooth and NFC technologies, it adds IoT control function applications to the intelligent fluorescent stick.
The flexible intelligent fluorescent stick substrate is mainly based on soft board and soft-hard combined board processes. The four-layer soft-hard combined circuit board process can effectively place more functional circuits into the space of the intelligent fluorescent stick. According to the specific space and functional requirements of the smart ring, we provide ODM services for circuit board components based on the soft-hard combined process for customers.
Product Feature Highlights: The four-layer soft-hard combined board is made of ultra-thin materials, and the LED light board needs to be designed and produced using white film or white oil processes.
Product Application: Intelligent fluorescent sticks for various application scenarios such as entertainment concerts, night fishing, weddings, outdoor activities, military operations, construction projects, and underwater operations.
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Flexible printed circuit smart glow stick four-layer rigid flexible pcb flex circuit board


Specifications:
Product holes: Minimum metallized hole diameter: 0.30mm ± 0.075mm; Minimum non-metallized hole diameter: 0.75mm ± 0.075mm
Product circuits: Minimum circuit width: 0.15mm ± 0.02mm; Minimum circuit spacing: 0.10mm ± 0.02mm
Product solder mask & characters: Customizable
Finished product dimensions: 215*18.10*0.45mm Surface treatment: Gold plating 1-2 layers
Functional test: Open circuit test Reliability test: Thermal shock test
Product circuits: Minimum circuit width: 0.15mm ± 0.02mm; Minimum circuit spacing: 0.10mm ± 0.02mm
Product solder mask & characters: Customizable
Finished product dimensions: 215*18.10*0.45mm Surface treatment: Gold plating 1-2 layers
Functional test: Open circuit test Reliability test: Thermal shock test
--Written by Lisa-25.11.20

PCB product Capacity
| Value | Specification |
PCB Max. size | 510mm*1200mm(SMT) |
| Remarks | High Tg CCL is Available(Tg>=180℃) |
| Finish Board Thickness | 0.2 mm-6.00mm(8mil-126mil) |
| Surface Finish | Gold finger(>=0.13um), Immersion Gold(0.025-0075um), Plating Gold(0.025-3.0um), HASL(5-20um), OSP(0.2-0.5um) |
| Shape | Routing、Punch、V-cut、Chamfer |
| Surface Treatment | Solder Mask(black, green, white, red, blue, thickness>=12um, Block, BGA) |
| Silkscreen(black, yellow, white) | |
| Peel able-mask(red, blue, thickness>=300um) | |
| Minimum Core | 0.075mm(3mil) |
| Copper Thickness | 1/2 oz min; 12oz max |
| Min Trace Width & Line Spacing | 0.075mm/0.1mm(3mil/4mil) |
| Min Hole Diameter for CNC Drilling | 0.1mm(4mil) |
| Min Hole Diameter for Punching | 0.6mm(35mil) |
| Biggest panel size | 610mm * 508mm |
| Hole Position | +/-0.075mm(3mil) CNC Drilling |
| Conductor Width(W) | +/-0.05mm(2mil) or +/-20% of original |
| Hole Diameter(H) | PTHL:+/-0.075mm(3mil) |
| Non PTHL:+/-0.05mm(2mil) | |
| Outline Tolerance | +/-0.1mm(5mil) CNC Routing |
| Warp & Twist | 0.70% |
| Insulation Resistance | 10Kohm-20Mohm |
| Conductivity | <50ohm |
| Test Voltage | 10-300V |
| Panel Size | 110 x 100mm(min) |
| 660 x 600mm(max) | |
| Layer-layer misregistration | 4 layers:0.15mm(6mil)max |
| 6 layers:0.25mm(10mil)max | |
| Min spacing between hole edge to circuitry pattern of an inner layer | 0.25mm(10mil) |
| Min spacing between board outline to circuitry pattern of an inner layer | 0.25mm(10mil) |
| Board thickness tolerance | 4 layers:+/-0.13mm(5mil) |
Flexible PCB product Capacity
| Value | Capabilities |
| Items | FR-4, FR1,FR2; CEM-1, CEM-3,Rogers,Teflon,Arlon,Aluminum Base, Copper Base,Ceramic, Crockery, etc. |
| Layers | FPC:1 to 6 Layers,Rigid Flex:2 to 10 Layers |
| Base Copper Thickness | 1/3 oz to 2oz |
| Regular Base Material Thickness | 12.5um to 50um(FPC) |
| 0.1mm to 3.2mm(Rigid) | |
| Regular Coverlay Thickness | 27um to 50um |
| Regular Adhesive Thickness | 12um to 25um |
| Blind or Buried Vias | Yes |
| Impedance Control | Yes |
| Min.Line Width/Spacing | 0.04mm/0.04mm |
| Surface Finishing | Electroplate Ni/Au(Flash gold/Soft gold/Hard gold),ENIG,Immersion Tin; plated silver;immersion silver ; OSP,HASL |
| Outline Fabrication | Die cut,laser cut,CNC routing,V-scoring |
| Hole to edge(Hard tool/Die Cut) | ±0.1/±0.2mm |
| Edge to edge(Hard tool/Die Cut) | ±0.05/±0.2mm |
| Circuit to edge(Hard tool/Die Cut) | ±0.07/±0.2mm |
PCB Assembly(SMT) Product Capacity
| Value | SMT Capacity |
| PCB Max. size | 510mm*1200mm(SMT) |
| Chip component | 01005,0201, 0402, 0603, 0805, 1206 package |
| Min.pin space of IC | 0.1mm |
| Min. space of BGA | 0.1mm |
| Max.precision of IC assembly | ±0.01mm |
| Surface Treatment | ≥8 million pionts/day |
| 6 DIP production lines | |
| Assembly testing | Current test, voltage test, high temperature and low temperature test. |
| Drop Impact Test,aging test,water proof test,leakage-proof test and etc. | |
| Different test can be done according to your requirement. |






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Q1:Are you a factory or trade company?
A: Xing Da Electronic Technology Co., ltd is leading OEM PCB&PCBA manufacturer in China with over 14 years rich experience. Our aim is “One-Stop service, smart manufacturing, make your production easier.”
Q2: What is needed for quotation?
A:1. PCB&FPC
We need Gerber files and specification for quotation
2. PCBA (= PCBA+ components + Assembly)
For PCBA, please send Gerber files, specification and Bom list for factory price.
A: Xing Da Electronic Technology Co., ltd is leading OEM PCB&PCBA manufacturer in China with over 14 years rich experience. Our aim is “One-Stop service, smart manufacturing, make your production easier.”
Q2: What is needed for quotation?
A:1. PCB&FPC
We need Gerber files and specification for quotation
2. PCBA (= PCBA+ components + Assembly)
For PCBA, please send Gerber files, specification and Bom list for factory price.
Q3:Is my PCB or PCBA files safe if I send it to you for manufacturing?
A: We respect customer's design authority and will never manufacture PCB or PCBA for someone else without your permission. We never share customer documents with third parties.NDA is acceptable.
Q4:What payment do you accept ?
A: T/T,Western Union,Paypal, L/C,Credit Card, Cheque,Others
A: We respect customer's design authority and will never manufacture PCB or PCBA for someone else without your permission. We never share customer documents with third parties.NDA is acceptable.
Q4:What payment do you accept ?
A: T/T,Western Union,Paypal, L/C,Credit Card, Cheque,Others
Q5: What's your shipping method?
A: 1. We have our own forwarders to ship goods with competitive price by DHL, UPS, FEDEX, TNT,EMS etc. We can also arrange shipments via sea or air depending on your specific requirements."
2. If you have your own forwarder, we can cooperate with them.
Q6: How about the MOQ?
A: There is no MOQ. We can produce prototypes, small orders, or large volumes.
A: 1. We have our own forwarders to ship goods with competitive price by DHL, UPS, FEDEX, TNT,EMS etc. We can also arrange shipments via sea or air depending on your specific requirements."
2. If you have your own forwarder, we can cooperate with them.
Q6: How about the MOQ?
A: There is no MOQ. We can produce prototypes, small orders, or large volumes.