OEM service for flexible NFC circuit boards (FPCs) for bend-resistant identity verification
pcbgate251213151
"Overview of NFC Antenna Flexible Circuit Board: NFC is a short-range, high-frequency wireless communication technology that enables data exchange and energy conversion between devices that are very close to each other. The NFC antenna flexible circuit board is made of flexible materials and is typically printed with antenna circuits on the flexible material using circuit board technology, giving it stable and flexible characteristics that can be easily integrated into various devices. NFC antenna flexible circuit boards are mostly in single-layer, double-layer, and multi-layer configurations. We can provide ODM services for flexible circuit board components based on NFC technology according to the specific space and functional requirements of the equipment for our customers."
"Product Feature Highlights:
The NFC antenna flexible circuit board is made of flexible materials and has the characteristics of being lightweight, flexible, and foldable. It has stable product performance and good consistency in the product.
Product applications: Mobile payment, transportation cards, access control, identity recognition, finance, wireless charging, data transmission, advertisement push, Bluetooth pairing, etc. The flexible circuit board with NFC antenna can also be used for data exchange, file transfer, energy transmission. No complicated settings are required; just a simple tap can achieve it.
"Product Feature Highlights:
The NFC antenna flexible circuit board is made of flexible materials and has the characteristics of being lightweight, flexible, and foldable. It has stable product performance and good consistency in the product.
Product applications: Mobile payment, transportation cards, access control, identity recognition, finance, wireless charging, data transmission, advertisement push, Bluetooth pairing, etc. The flexible circuit board with NFC antenna can also be used for data exchange, file transfer, energy transmission. No complicated settings are required; just a simple tap can achieve it.
Quantity:
US $1.00
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OEM service for flexible NFC circuit boards (FPCs) for bend-resistant identity verification
Specifications:
Product holes: Minimum metallized hole diameter: 0.25 ± 0.075 mm; Minimum non-metallized hole diameter: None
Product circuits: Minimum circuit width: 1.00 ± 0.02 mm; Minimum circuit spacing: 0.50 ± 0.02 mm
Product solder mask & characters: Double-sided pad window, 12.5 um yellow coating film, no character layer
Finished product related dimensions: 65.96 * 51.00 mm * 0.30 mm
Surface processing: Gold plating process, gold thickness 1-2 u″, nickel thickness 60-100 u″
Function test: LCR test
Reliability test: Thermal shock test Product-related certification tests: ROSH certification
Product circuits: Minimum circuit width: 1.00 ± 0.02 mm; Minimum circuit spacing: 0.50 ± 0.02 mm
Product solder mask & characters: Double-sided pad window, 12.5 um yellow coating film, no character layer
Finished product related dimensions: 65.96 * 51.00 mm * 0.30 mm
Surface processing: Gold plating process, gold thickness 1-2 u″, nickel thickness 60-100 u″
Function test: LCR test
Reliability test: Thermal shock test Product-related certification tests: ROSH certification
--Written by Liya-25.12.27
PCB product Capacity
| Value | Specification |
PCB Max. size | 510mm*1200mm(SMT) |
| Remarks | High Tg CCL is Available(Tg>=180℃) |
| Finish Board Thickness | 0.2 mm-6.00mm(8mil-126mil) |
| Surface Finish | Gold finger(>=0.13um), Immersion Gold(0.025-0075um), Plating Gold(0.025-3.0um), HASL(5-20um), OSP(0.2-0.5um) |
| Shape | Routing、Punch、V-cut、Chamfer |
| Surface Treatment | Solder Mask(black, green, white, red, blue, thickness>=12um, Block, BGA) |
| Silkscreen(black, yellow, white) | |
| Peel able-mask(red, blue, thickness>=300um) | |
| Minimum Core | 0.075mm(3mil) |
| Copper Thickness | 1/2 oz min; 12oz max |
| Min Trace Width & Line Spacing | 0.075mm/0.1mm(3mil/4mil) |
| Min Hole Diameter for CNC Drilling | 0.1mm(4mil) |
| Min Hole Diameter for Punching | 0.6mm(35mil) |
| Biggest panel size | 610mm * 508mm |
| Hole Position | +/-0.075mm(3mil) CNC Drilling |
| Conductor Width(W) | +/-0.05mm(2mil) or +/-20% of original |
| Hole Diameter(H) | PTHL:+/-0.075mm(3mil) |
| Non PTHL:+/-0.05mm(2mil) | |
| Outline Tolerance | +/-0.1mm(5mil) CNC Routing |
| Warp & Twist | 0.70% |
| Insulation Resistance | 10Kohm-20Mohm |
| Conductivity | <50ohm |
| Test Voltage | 10-300V |
| Panel Size | 110 x 100mm(min) |
| 660 x 600mm(max) | |
| Layer-layer misregistration | 4 layers:0.15mm(6mil)max |
| 6 layers:0.25mm(10mil)max | |
| Min spacing between hole edge to circuitry pattern of an inner layer | 0.25mm(10mil) |
| Min spacing between board outline to circuitry pattern of an inner layer | 0.25mm(10mil) |
| Board thickness tolerance | 4 layers:+/-0.13mm(5mil) |
Flexible PCB product Capacity
| Value | Capabilities |
| Items | FR-4, FR1,FR2; CEM-1, CEM-3,Rogers,Teflon,Arlon,Aluminum Base, Copper Base,Ceramic, Crockery, etc. |
| Layers | FPC：1 to 6 Layers,Rigid Flex：2 to 10 Layers |
| Base Copper Thickness | 1/3 oz to 2oz |
| Regular Base Material Thickness | 12.5um to 50um（FPC） |
| 0.1mm to 3.2mm（Rigid） | |
| Regular Coverlay Thickness | 27um to 50um |
| Regular Adhesive Thickness | 12um to 25um |
| Blind or Buried Vias | Yes |
| Impedance Control | Yes |
| Min.Line Width/Spacing | 0.04mm/0.04mm |
| Surface Finishing | Electroplate Ni/Au（Flash gold/Soft gold/Hard gold）,ENIG,Immersion Tin; plated silver;immersion silver ; OSP,HASL |
| Outline Fabrication | Die cut,laser cut,CNC routing,V-scoring |
| Hole to edge(Hard tool/Die Cut) | ±0.1/±0.2mm |
| Edge to edge(Hard tool/Die Cut) | ±0.05/±0.2mm |
| Circuit to edge(Hard tool/Die Cut) | ±0.07/±0.2mm |
PCB Assembly(SMT) Product Capacity
| Value | SMT Capacity |
| PCB Max. size | 510mm*1200mm(SMT) |
| Chip component | 01005,0201, 0402, 0603, 0805, 1206 package |
| Min.pin space of IC | 0.1mm |
| Min. space of BGA | 0.1mm |
| Max.precision of IC assembly | ±0.01mm |
| Surface Treatment | ≥8 million pionts/day |
| 6 DIP production lines | |
| Assembly testing | Current test, voltage test, high temperature and low temperature test. |
| Drop Impact Test,aging test,water proof test,leakage-proof test and etc. | |
| Different test can be done according to your requirement. |
Quality Control
Customers Visit our factory
Exhibition Show
Munich Exhibition&Moscow：
Russia Exhibition：
Q1:Are you a factory or trade company?
A: Xing Da Electronic Technology Co., ltd is leading OEM PCB&PCBA manufacturer in China with over 14 years rich experience. Our aim is “One-Stop service, smart manufacturing, make your production easier.”
Q2: What is needed for quotation?
A:1. PCB&FPC
We need Gerber files and specification for quotation
2. PCBA (= PCBA+ components + Assembly)
For PCBA, please send Gerber files, specification and Bom list for factory price.
A: Xing Da Electronic Technology Co., ltd is leading OEM PCB&PCBA manufacturer in China with over 14 years rich experience. Our aim is “One-Stop service, smart manufacturing, make your production easier.”
Q2: What is needed for quotation?
A:1. PCB&FPC
We need Gerber files and specification for quotation
2. PCBA (= PCBA+ components + Assembly)
For PCBA, please send Gerber files, specification and Bom list for factory price.
Q3:Is my PCB or PCBA files safe if I send it to you for manufacturing?
A: We respect customer's design authority and will never manufacture PCB or PCBA for someone else without your permission. We never share customer documents with third parties.NDA is acceptable.
Q4:What payment do you accept ?
A: T/T,Western Union,Paypal, L/C,Credit Card, Cheque,Others
A: We respect customer's design authority and will never manufacture PCB or PCBA for someone else without your permission. We never share customer documents with third parties.NDA is acceptable.
Q4:What payment do you accept ?
A: T/T,Western Union,Paypal, L/C,Credit Card, Cheque,Others
Q5: What's your shipping method?
A: 1. We have our own forwarders to ship goods with competitive price by DHL, UPS, FEDEX, TNT,EMS etc. We can also arrange shipments via sea or air depending on your specific requirements."
2. If you have your own forwarder, we can cooperate with them.
Q6: How about the MOQ?
A: There is no MOQ. We can produce prototypes, small orders, or large volumes.
A: 1. We have our own forwarders to ship goods with competitive price by DHL, UPS, FEDEX, TNT,EMS etc. We can also arrange shipments via sea or air depending on your specific requirements."
2. If you have your own forwarder, we can cooperate with them.
Q6: How about the MOQ?
A: There is no MOQ. We can produce prototypes, small orders, or large volumes.
